NVIDIA

6 days ago

Hardware Failure Analysis Engineer – Physical Failure Analysis

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 22 hours agoStatus: Live

Job Summary

Join the Interconnect Failure Analysis team within Product Engineering to investigate hardware failures at the physical level. You’ll lead destructive and non-destructive sample preparation, perform root-cause analyses using advanced tools like SEM, FIB, and X-ray/CT, and correlate physical findings with electrical, optical, manufacturing, and reliability data. Partner across design, manufacturing, quality, reliability, packaging, and systems teams, and deliver clear technical reports while improving lab methodologies and capabilities.

Location: Israel

Workplace: Onsite

Employment Type: Full time

Job Function: Data Science & Machine Learning

Seniority: Mid level

Key Responsibilities

•Lead physical failure analysis investigations on advanced interconnect products including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.
•Develop, optimize, and execute destructive and non-destructive sample preparation techniques to expose failure sites while preserving physical evidence.
•Perform detailed failure analysis using microscopy and analytical methods such as SEM, FIB cross-sectioning/circuit editing, optical microscopy, and X-ray/CT.
•Correlate physical findings with electrical, optical, manufacturing, and reliability data to determine root cause.
•Design new failure analysis methodologies, improve lab workflows/capabilities, partner with cross-functional engineering teams, and generate technical reports.

Key Requirements

•B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.
•3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.
•Hands-on destructive sample preparation experience including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.
•Strong experience operating analytical equipment including SEM, FIB, X-ray/CT, and optical microscopy.
•Strong understanding of hardware failure mechanisms and the ability to independently drive complex investigations from failure to root cause.

Experience:3+ years

Education:Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Physics (or related field)

Skills:AnalyticalDocumentationCommunicationIndependent problem-solvingRoot cause investigation

Tech Stack:Scanning Electron Microscopy (SEM)Focused Ion Beam (FIB)X-ray imagingCTOptical microscopySample preparationCross-sectioningCircuit editingDecelerationPolishingGrindingDecapsulation

Company Brief

NVIDIA

Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor

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NVIDIA

6 days ago

Hardware Failure Analysis Engineer – Physical Failure Analysis

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 22 hours agoStatus: Live

Job Summary

Location: Israel

Workplace: Onsite

Employment Type: Full time

Job Function: Data Science & Machine Learning

Seniority: Mid level

Key Responsibilities

•Lead physical failure analysis investigations on advanced interconnect products including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.
•Develop, optimize, and execute destructive and non-destructive sample preparation techniques to expose failure sites while preserving physical evidence.
•Perform detailed failure analysis using microscopy and analytical methods such as SEM, FIB cross-sectioning/circuit editing, optical microscopy, and X-ray/CT.
•Correlate physical findings with electrical, optical, manufacturing, and reliability data to determine root cause.
•Design new failure analysis methodologies, improve lab workflows/capabilities, partner with cross-functional engineering teams, and generate technical reports.

Key Requirements

•B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.
•3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.
•Hands-on destructive sample preparation experience including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.
•Strong experience operating analytical equipment including SEM, FIB, X-ray/CT, and optical microscopy.
•Strong understanding of hardware failure mechanisms and the ability to independently drive complex investigations from failure to root cause.

Experience:3+ years

Education:Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Physics (or related field)

Skills:AnalyticalDocumentationCommunicationIndependent problem-solvingRoot cause investigation

Tech Stack:Scanning Electron Microscopy (SEM)Focused Ion Beam (FIB)X-ray imagingCTOptical microscopySample preparationCross-sectioningCircuit editingDecelerationPolishingGrindingDecapsulation

Company Brief

NVIDIA

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor