Intel

1 day ago

Director – PDK Architecture

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Lead the PDK Architecture team to drive technical execution of Intel’s Process Design Kit across leading-edge technology nodes. Own PDK targeting, scope, specification methodology, quality standards, and governance, ensuring requirements translate into scalable, customer-ready deliverables. Serve as the key bridge between Technology Development, PDK Development, and EDA partners, execute 3DIC/advanced packaging PDK architecture roadmap, and lead executive reviews to close readiness gaps across multiple domains.

Location: Santa Clara, Phoenix, Austin

Workplace: Onsite

Employment Type: Full time

Job Function: Architecture & Urban Planning

Seniority: Director level

Key Responsibilities

•Lead definition and specification of PDK scope and content, aligning and locking down inputs with Technology Definition before execution.
•Drive technology closure and readiness assessments across multiple domains (Logic, SRAM, AMS, APR, Reliability, Packaging).
•Make technical architecture and implementation decisions for PDK, and define standards and repeatable processes to streamline delivery.
•Own PDK specification methodology, quality standards, and governance, including machine-readable and AI-enabled specification frameworks and signoff processes.
•Lead 3DIC enablement by defining and executing the architecture roadmap for 3DIC and advanced packaging PDK solutions and collateral releases.

Pay and Benefits

Salary: USD 233,990 - 330,340 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•MS or PhD in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related discipline.
•10+ years in semiconductor technology development, design enablement, EDA, PDK development, CAD, DTCO, or related fields.
•Strong communication and executive presentation skills.
•Experience with foundry PDK development and release processes.
•Understanding of design rules, extraction, modeling, physical verification, custom design flows, APR flows, and validation methodologies.

Experience:10+ yearsSemiconductor technology developmentEDAPDK developmentCAD3DICAdvanced packaging

Education:Master's

Skills:Cross-functional leadershipExecutive communicationProgram executionTechnical leadershipOrganizational transformation

Tech Stack:Process Design KitPDK3DICAdvanced packagingEDASynopsysCadenceSiemensCADDTCOMachine-readableAI-enabledAutomation frameworksPhysical verificationAPR

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 day ago

Director – PDK Architecture

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: Santa Clara, Phoenix, Austin

Workplace: Onsite

Employment Type: Full time

Job Function: Architecture & Urban Planning

Seniority: Director level

Key Responsibilities

•Lead definition and specification of PDK scope and content, aligning and locking down inputs with Technology Definition before execution.
•Drive technology closure and readiness assessments across multiple domains (Logic, SRAM, AMS, APR, Reliability, Packaging).
•Make technical architecture and implementation decisions for PDK, and define standards and repeatable processes to streamline delivery.
•Own PDK specification methodology, quality standards, and governance, including machine-readable and AI-enabled specification frameworks and signoff processes.
•Lead 3DIC enablement by defining and executing the architecture roadmap for 3DIC and advanced packaging PDK solutions and collateral releases.

Pay and Benefits

Salary: USD 233,990 - 330,340 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•MS or PhD in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related discipline.
•10+ years in semiconductor technology development, design enablement, EDA, PDK development, CAD, DTCO, or related fields.
•Strong communication and executive presentation skills.
•Experience with foundry PDK development and release processes.
•Understanding of design rules, extraction, modeling, physical verification, custom design flows, APR flows, and validation methodologies.

Experience:10+ yearsSemiconductor technology developmentEDAPDK developmentCAD3DICAdvanced packaging

Education:Master's

Skills:Cross-functional leadershipExecutive communicationProgram executionTechnical leadershipOrganizational transformation

Tech Stack:Process Design KitPDK3DICAdvanced packagingEDASynopsysCadenceSiemensCADDTCOMachine-readableAI-enabledAutomation frameworksPhysical verificationAPR

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor