Senior Engineer, Technology - AMAIS

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Communication","Collaboration","Problem-solving","Analytical thinking"]

Develop composite, physics-grounded models for DRAM module co-optimization, spanning wafer- and die-level metrics. Extract and communicate insights from predictive models, images, and data, while integrating ML and agentic solutions into engineering-ready composite models. Train robust models on sparse datasets using computational/AI methods, apply multiscale stress modeling for risk assessment, and support root-cause analysis and process integration strategies to improve yield.

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FursaFursa
Micron Technology
Micron Technology
1 day ago

Senior Engineer, Technology - AMAIS

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Develop composite, physics-grounded models for DRAM module co-optimization, spanning wafer- and die-level metrics. Extract and communicate insights from predictive models, images, and data, while integrating ML and agentic solutions into engineering-ready composite models. Train robust models on sparse datasets using computational/AI methods, apply multiscale stress modeling for risk assessment, and support root-cause analysis and process integration strategies to improve yield.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop composite models grounded in structural and stress physics to enable module co-optimization across wafer- and die-level metrics.
  • •Extract insights from predictive models, images, and data, and clearly communicate findings to engineering teams and leaders.
  • •Collaborate across functions to integrate ML and agentic solutions into composite models that meet engineering needs.
  • •Build structural models integrating process flow, layout, materials, and thermo-mechanical response; apply multiscale stress modeling for stress/strain/risk assessment.
  • •Support root-cause analysis and predictive risk assessment using physics-based models augmented with data to drive model-informed process integration strategies and improve yield.

Pay and Benefits

Perks:Time OffContinuous LearningWellness StipendEquityHealth InsuranceDentalVisionParental LeavePaid Holidays

Key Requirements

  • •Bachelor’s with 5+ years, or MS with 3+ years, or PhD (or equivalent) in Engineering, Artificial Intelligence, Data Science, Applied Mathematics/Sciences, or related fields.
  • •Advanced expertise in multiscale structural modeling.
  • •Strong foundation in numerical methods, high-performance computing (HPC), and ML/AI algorithms.
  • •Experience with innovative multiphysics/multiscale methods and ML/DL/AI libraries for high-dimensional, dynamic datasets.
  • •Proficiency in Linux, C++, and Python, with experience in cloud or HPC environments.
Experience:5+ yearsSemiconductor industryMemory industryDRAMMultiphysicsHPC
Education:Bachelor's
Skills:CommunicationCollaborationProblem-solvingAnalytical thinking
Tech Stack:LinuxC++PythonHPCCloudML/DL/AI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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