3 days ago

PMTS Packaging Engineer

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Last checked: 8 hours agoStatus: Live

Job Summary

Lead advanced semiconductor assembly technology development with OSAT and foundry partners, while driving technology improvements across the industry to meet future requirements. Collaborate with integration and design teams to integrate assembly needs and plan capability enhancements. Build an ecosystem of partners to define an assembly capability improvement roadmap, applying hands-on process expertise and structured technology development methods.

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Lead assembly technology development with OSAT and foundry partners to meet technology development deliverables.
•Drive technology development across the industry to address future requirements.
•Collaborate with integration and design teams to integrate assembly and design needs.
•Formulate plans to enhance assembly capabilities to meet design needs.
•Establish ecosystem partners to identify and guide an assembly capability improvement roadmap.

Pay and Benefits

Salary: TWD 2,888,620 - 4,126,600 annually

Key Requirements

•Minimum Msc in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
•In-depth knowledge of key assembly processes including die prep, die bond methods, underfill, and lid attach.
•Hands-on experience with large module/die assembly, including chip on wafer/panel and chip on substrate.
•Experience using typical technology development tools and quality/process methods such as FMEA, SPC, and control plans.
•Ability to communicate well in both English and Chinese.

Experience:Semiconductor assemblyTechnology development

Education:Master's in Mechanical Engineering, Electrical Engineering, Materials Science, Physics

Skills:Self-motivatedIndependent workCommunicationLeadershipCollaboration

Languages:EnglishChinese

Tech Stack:OSATDie prepDie bond methodsUnderfillLid attachChip on waferChip on panelChip on substrateFMEASPCControl plans

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD