Senior Wirebond Equipment Engineer

Texas Instruments
Malaysia
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Communication","Analytical thinking","Critical thinking","Problem-solving","Teamwork"]

Own wirebond equipment reliability and uptime for semiconductor manufacturing by selecting and maintaining KNS/ASM wirebond tools. Oversee installation, upgrades, and preventive maintenance, track manufacturer technical notices, and study equipment performance to resolve issues impacting production. Provide technical support to repair and process engineering teams while improving bonding process performance and documentation in a fast-paced cleanroom environment.

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Texas Instruments
Texas Instruments
1 day ago

Senior Wirebond Equipment Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Own wirebond equipment reliability and uptime for semiconductor manufacturing by selecting and maintaining KNS/ASM wirebond tools. Oversee installation, upgrades, and preventive maintenance, track manufacturer technical notices, and study equipment performance to resolve issues impacting production. Provide technical support to repair and process engineering teams while improving bonding process performance and documentation in a fast-paced cleanroom environment.
Location: Malaysia
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Evaluate, select, and order equipment that is most appropriate and cost effective for product manufacture.
  • •Oversee installation, modification, upgrades, and maintenance of manufacturing equipment.
  • •Monitor equipment manufacturer technical notices, upgrades, and safety issues.
  • •Study equipment performance and reliability and establish solutions to increase uptime.
  • •Provide technical support to equipment repair and process engineering organizations and define preventative maintenance schedules.

Key Requirements

  • •Bachelor’s degree in Electronics/Electrical Engineering, Mechanical Engineering, or a related engineering field.
  • •Minimum 5 years as a Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance experience in semiconductor manufacturing operations.
  • •Hands-on ability with KNS and ASM wirebond machines and wire bond process equipment experience.
  • •Experience with gold/copper/PCC wire & bump ball process bonding.
  • •Working knowledge of semiconductor manufacturing and SPC/Spotfire techniques, including semiconductor cleanroom protocol and behaviors.
Experience:5+ yearsSemiconductor manufacturingWire bondingEquipment maintenanceCleanroom operations
Education:Bachelor's in Electronics or Electrical engineering, Mechanical Engineering or related engineering degree
Skills:CommunicationAnalytical thinkingCritical thinkingProblem-solvingTeamwork
Tech Stack:WirebondKNSASMGoldCuPCCBump ballPlasmaDie coatTool monitoringInterdiction softwareSPCSpotfireCleanroom protocolAMAT PVDAMAT TxZPVDCVDHigh vacuumUltra high vacuum

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn