On Shift (IOS) Technology Development Engineer – Night Shift 6

Intel
Phoenix
Workplace: OnsiteFull timeUSD 85,200 - 139,810 annuallyFunction: Product ManagementExperience: 1+ yearsEducation: bachelorsSkills: ["Collaboration","Problem-solving","Continuous learning","Communication","Interpersonal skills"]

Support advanced semiconductor packaging technology by providing real-time process and defect characterization on night shifts at the pilot line. Collaborate with Integration, program leads, and factory teams to align daily priorities, manage lot execution, respond to process issues and error recoveries, and run experiments for feasibility studies and process improvements. Use big data analysis and model-based problem solving, and document/update specs and BKM’s to enable safe, high-quality, reliable output.

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Intel
Intel
5 days ago

On Shift (IOS) Technology Development Engineer – Night Shift 6

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Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Support advanced semiconductor packaging technology by providing real-time process and defect characterization on night shifts at the pilot line. Collaborate with Integration, program leads, and factory teams to align daily priorities, manage lot execution, respond to process issues and error recoveries, and run experiments for feasibility studies and process improvements. Use big data analysis and model-based problem solving, and document/update specs and BKM’s to enable safe, high-quality, reliable output.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Support factory velocity and quality on the shift, collaborating with Tool Owners and Manufacturing Techs to support the floor.
  • •Align daily priorities with Segment Integration and Program Management and communicate issues to day-shift stakeholders for immediate follow-up.
  • •Provide engineering-level support for lot execution, focusing on route/DOE setup and data review to meet program deliverables.
  • •Respond to process issues, error recoveries, and ad hoc factory requests with timely disposition decisions.
  • •Utilize model-based problem solving and perform feasibility studies, experiments, and defect/process characterization to improve safety, quality, reliability, and output; update specs and BKM’s.

Pay and Benefits

Salary: USD 85,200 - 139,810 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a similar STEM field.
  • •1+ years of experience with manufacturing processes.
  • •Not eligible for Intel immigration sponsorship.
  • •General knowledge of the semiconductor packaging process.
  • •Experience owning process tools with knowledge of SPC, PCS, equipment troubleshooting, and statistical design of experiments.
Experience:1+ yearsSemiconductor packagingManufacturingProcess development
Education:Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering
Skills:CollaborationProblem-solvingContinuous learningCommunicationInterpersonal skills

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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