Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 85,200 - 162,500 annuallyFunction: Product ManagementEducation: bachelorsSkills: ["Analytical problem-solving","Written and verbal communication","Independent work","Cross-functional collaboration","Adaptability"]

Develop and optimize advanced packaging substrate processes and equipment for Intel’s next-generation packaging platform technologies. Define process specifications and integrated process flows, run DOEs to map process windows, and drive continuous improvements across capability, stability, quality/reliability, cost/yield, automation, and productivity. Partner with cross-functional teams to solve complex substrate process challenges in a fast-paced, evolving roadmap environment.

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Intel
Intel
3 days ago

Packaging Module Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Develop and optimize advanced packaging substrate processes and equipment for Intel’s next-generation packaging platform technologies. Define process specifications and integrated process flows, run DOEs to map process windows, and drive continuous improvements across capability, stability, quality/reliability, cost/yield, automation, and productivity. Partner with cross-functional teams to solve complex substrate process challenges in a fast-paced, evolving roadmap environment.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Define and establish equipment configurations, process specifications, and integrated process flow for new substrate process technologies.
  • •Plan and conduct DOEs to characterize the process window and understand interactions between process, equipment, materials, and chemistry.
  • •Drive continuous process improvements across process capability/stability, quality/reliability, cost/yield, automation, and productivity.
  • •Lead and participate in cross-functional and cross-organizational teams supporting substrate technology development.
  • •Work effectively in ambiguous, fast-paced environments with changing priorities to support business needs.

Pay and Benefits

Salary: USD 85,200 - 162,500 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in Biomedical Engineering, Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, or related STEM engineering, or a Master’s degree in the same fields.
  • •Minimum 3+ months of experience combining circuit assembly and embedded programming.
  • •Engineering programming skills using tools such as Matlab, Python, and CAD modeling.
  • •Experience with commercial Mechanical and/or CFD modeling tools such as Comsol, Fluent, Ansys, or similar.
  • •Knowledge of semiconductor and/or packaging processing, plus plating chemistry/electrochemistry fundamentals.
Education:Bachelor's in Biomedical Engineering, Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, or related engineering degree
Skills:Analytical problem-solvingWritten and verbal communicationIndependent workCross-functional collaborationAdaptability
Tech Stack:MatlabPythonCAD ModelingComsolFluentAnsysCFDMechanical modelingAIMachine Learning

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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