TD Media and Collaterals Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 85,200 - 120,280 annuallyFunction: Product ManagementEducation: bachelorsSkills: ["Data analysis","Problem-solving","Technical innovation","Documentation"]

Develop assembly processes and equipment for Intel’s future assembly packaging platform technologies. Optimize manufacturing package efficiency across quality, reliability, cost, yield, productivity, and manufacturability. Define process/equipment specifications using design of experiments and statistical analysis, evaluate silicon and package technologies under simulated field conditions, and drive reliability and packaging quality screening. Partner with supplier quality, procurement, and engineering groups to standardize qualification and continuously improve equipment and processes.

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FursaFursa
Intel
Intel
4 days ago

TD Media and Collaterals Development Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Develop assembly processes and equipment for Intel’s future assembly packaging platform technologies. Optimize manufacturing package efficiency across quality, reliability, cost, yield, productivity, and manufacturability. Define process/equipment specifications using design of experiments and statistical analysis, evaluate silicon and package technologies under simulated field conditions, and drive reliability and packaging quality screening. Partner with supplier quality, procurement, and engineering groups to standardize qualification and continuously improve equipment and processes.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop assembly processes and/or equipment to enable Intel’s future assembly packaging platform technologies.
  • •Optimize manufacturing package efficiency to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Develop process and equipment specifications using design of experiments and data analysis, documenting improvements in white papers.
  • •Develop and maintain equipment to evaluate silicon and package technologies under simulated field use conditions.
  • •Set reliability requirements and consult on packaging problems and improvements, standardizing qualification and engaging with partner engineering groups.

Pay and Benefits

Salary: USD 85,200 - 120,280 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s (mechanical engineering/material engineering/electrical engineering/physics) or a master’s in a related technical discipline.
  • •Minimum 6 months of experience applying fundamental science and engineering concepts to develop novel solutions.
  • •Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
  • •Preferred: Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
  • •Preferred: Assembly equipment, process, media, and/or collateral experience.
Experience:Semiconductor manufacturingAssembly packaging
Education:Bachelor's
Skills:Data analysisProblem-solvingTechnical innovationDocumentation
Tech Stack:SolidWorksAutoCADStatistical Process Control (SPC)Design of Experiments (DOE)

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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