Engineer – 3D NAND Process Integration

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: mastersSkills: ["Communication","Cross-functional collaboration","Problem-solving","Self-motivation","Continuous improvement"]

Design, develop, integrate, and implement process solutions for next-generation 3D NAND to improve product yield and quality while meeting cost, performance, and timeline targets. Lead cross-functional efforts to diagnose module deficiencies, refine CSPEC criteria, coordinate manufacturing experiments and technology transfers, and establish proofs of concept for future tech nodes. Present progress in yield summits and program reviews, and support ramp-up, qualification, and documentation training.

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Micron Technology
Micron Technology
11 hours ago

Engineer – 3D NAND Process Integration

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Last checked: 18 minutes agoStatus: Live

Job Summary

Design, develop, integrate, and implement process solutions for next-generation 3D NAND to improve product yield and quality while meeting cost, performance, and timeline targets. Lead cross-functional efforts to diagnose module deficiencies, refine CSPEC criteria, coordinate manufacturing experiments and technology transfers, and establish proofs of concept for future tech nodes. Present progress in yield summits and program reviews, and support ramp-up, qualification, and documentation training.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Design and implement innovative process solutions to improve next-generation 3D NAND yield and quality within timeline and cost/performance constraints.
  • •Identify and quantify module deficiencies and technology gaps, leading cross-functional teams to improve process flows and deliver manufacturability.
  • •Develop or redefine CSPEC criteria and drive manufacturing process capability activities to meet product performance needs.
  • •Coordinate manufacturing-site activities to secure funding for experiments and conversions, and communicate decisions to R&D, Product Engineering, and Manufacturing partners.
  • •Lead program updates (yield summits and program reviews) and support technology transfer, ramp-up/qualification, and documentation/training into manufacturing.

Pay and Benefits

Perks:Paid LeaveHealth InsuranceEquityWellness Stipend

Key Requirements

  • •2+ years of semiconductor industry experience with strong data analysis, problem-solving, and process integration optimization skills.
  • •Strong communication skills and ability to work effectively in cross-functional teams.
  • •Proficiency with data analysis/visualization/simulation tools (JMP or Tableau desirable).
  • •Ability to develop an end-to-end understanding of PI modules for new NAND technologies, including structural/electrical failure mechanisms.
  • •BS, MS/PhD in Material Science, Electrical Engineering, Microelectronics, Chemical, Physics Engineering, or a related field.
Experience:2+ yearsSemiconductorNAND3D NANDR&D
Education:Master's in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering (or related field)
Skills:CommunicationCross-functional collaborationProblem-solvingSelf-motivationContinuous improvement
Tech Stack:JMPTableauAI-assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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