Microelectronic Packaging Technical Lead Project Engineer
California
Workplace: OnsiteFull timeUSD 146,200 - 197,800 annuallyFunction: Construction, Civil & Site EngineeringExperience: 9+ yearsEducation: bachelorsSkills: ["Analytical","Written communication","Verbal communication","Interpersonal skills","Presentation skills"]Lead and coordinate microelectronic packaging projects to support the development and delivery of processor packaging solutions, including 3D advanced packaging. Own project execution across the program lifecycle—managing statements of work, tracking progress and performance metrics, and guiding trade studies and source selection. Collaborate with cross-functional engineers, suppliers, test, and software/firmware teams to manage risks, align plans, and deliver on cost and schedule goals.
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