SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: mastersSkills: ["Data analysis","Troubleshooting","Problem-solving","Communication","Teamwork"]

Drive silicon node packaging product yield and quality improvements for DRAM through process integration expertise, business process management, and network project execution. Lead the PI Loop taskforce to address yield and quality challenges, optimize process flow to meet BIC yield targets, and benchmark internal/external intelligence. Use AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate root-cause analysis, improve decision-making, and support continuous innovation across yield and business processes.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI

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Last checked: 3 hours agoStatus: Live
Reposted: similar role first listed 1 week ago

Job Summary

Drive silicon node packaging product yield and quality improvements for DRAM through process integration expertise, business process management, and network project execution. Lead the PI Loop taskforce to address yield and quality challenges, optimize process flow to meet BIC yield targets, and benchmark internal/external intelligence. Use AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate root-cause analysis, improve decision-making, and support continuous innovation across yield and business processes.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive packaging product yield and quality improvements via PI technical expertise, business process management, and project execution across the global Micron network.
  • •Promote worldwide benchmark performance and efficiency gains through global project management, network BKM leveraging/enhancement, and business process creation/re-engineering.
  • •Define and execute qualification strategies linking packaging technology and interactions with front-end manufacturing processes ahead of product qualification.
  • •Lead PI Loop taskforce/team efforts to address yield and quality challenges and optimize process flow to achieve BIC yield performance.
  • •Use AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity and decision quality, and drive continuous innovation; travel to Micron fab locations as needed.
Travel: High travel

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering, or related fields.
  • •5 years of relevant experience in semiconductor device physics, DRAM operations, wafer fabrication process flows, and parametric/electrical test and probe yield.
  • •3 years of relevant experience in DRAM High Performance Memory (HPM), BEOL integration, advanced packaging, and layout.
  • •Strong data analysis, troubleshooting, problem-solving, reporting, and presentation skills with attention to detail in the semiconductor industry.
  • •Intermediate to advanced proficiency with Microsoft Office and AI-enabled productivity tools (e.g., Microsoft Copilot), plus strong communication and organizational skills.
Experience:SemiconductorsDRAMWafer fabricationMicroelectronicsPackaging
Education:Master's
Skills:Data analysisTroubleshootingProblem-solvingCommunicationTeamwork
Tech Stack:Microsoft OfficeMicrosoft Copilot

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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