Engineer, Process Development (Core Engineering Module)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Data analysis","Statistical analysis","Problem-solving","Communication","Leadership"]

Drive NPI (New Product Introduction) and process development for semiconductor packaging, from qualification through transfer to high-volume manufacturing. Execute technical risk assessment and quality documentation, improve yield and cost, and develop process recipes and characterization to define key operating parameters. Lead defect elimination using data analysis and statistical problem-solving, while collaborating cross-functionally across NPI, HVM, suppliers, and global teams.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
3 months ago

Engineer, Process Development (Core Engineering Module)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Drive NPI (New Product Introduction) and process development for semiconductor packaging, from qualification through transfer to high-volume manufacturing. Execute technical risk assessment and quality documentation, improve yield and cost, and develop process recipes and characterization to define key operating parameters. Lead defect elimination using data analysis and statistical problem-solving, while collaborating cross-functionally across NPI, HVM, suppliers, and global teams.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and continuous improvement within scope.
  • •Execute assembly process for NPI success and ensure smooth transfer from NPI to high-volume manufacturing, including qualification against planned timelines.
  • •Own NPI business process support by performing process technical risk assessment, and creating/maintaining SPC, FMEA, and quality control plan documentation.
  • •Deliver best-in-class yield and cost for NPI by integrating Design for Manufacturing (DFM) guidance, process guidelines, and design rules.
  • •Serve as process owner for continuous improvement in process yield, defect elimination, and process characterization, including data-driven detection, problem solving, and recipe development.

Key Requirements

  • •Bachelor’s degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor, or a related engineering discipline.
  • •Fresh graduate encouraged; 0–2 years experience in semiconductor packaging, assembly, or process integration.
  • •Strong data and statistical analysis skills with the ability to make data-driven decisions.
  • •Analytical, logical, and critical thinking with due diligence in day-to-day tasks.
  • •Strong interest in semiconductor engineering, plus leadership potential and effective communication across teams.
Experience:0SemiconductorSemiconductor packagingAssemblyProcess integration
Education:Bachelor's in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related engineering discipline
Skills:Data analysisStatistical analysisProblem-solvingCommunicationLeadership
Tech Stack:C++AutoCADAspen HYSYSCAssembly Language

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn