HBM Design Engineering Lead - MTS/SMTS/DMTS

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 15+ yearsSkills: ["Communication","Mentoring","Leadership"]

Lead critical High Bandwidth Memory (HBM) design blocks for AI and accelerated computing, driving architecture through schematic, implementation, verification, tape-out, and post-silicon debug. Balance performance, power, reliability, yield, and manufacturability trade-offs, and perform root-cause analysis across circuit, architecture, process, and packaging interactions. Serve as technical project lead coordinating multidisciplinary teams, mentor engineers, and influence next-generation HBM architectures aligned to DRAM and JEDEC standards.

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Micron Technology
Micron Technology
1 week ago

HBM Design Engineering Lead - MTS/SMTS/DMTS

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Last checked: 13 hours agoStatus: Live

Job Summary

Lead critical High Bandwidth Memory (HBM) design blocks for AI and accelerated computing, driving architecture through schematic, implementation, verification, tape-out, and post-silicon debug. Balance performance, power, reliability, yield, and manufacturability trade-offs, and perform root-cause analysis across circuit, architecture, process, and packaging interactions. Serve as technical project lead coordinating multidisciplinary teams, mentor engineers, and influence next-generation HBM architectures aligned to DRAM and JEDEC standards.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Own and deliver critical HBM design blocks and subsystems from architectural definition through schematic, implementation, verification, tape-out, and post-silicon debug.
  • •Drive robust, high-performance designs by balancing performance, power, reliability, yield, and manufacturability trade-offs.
  • •Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, architecture, process integration, and packaging interactions.
  • •Serve as technical project lead for one or more HBM programs, coordinating execution across architecture, layout, verification, validation, process integration, packaging, test, and product engineering teams.
  • •Define and communicate technical strategy, priorities, execution plans, and identify risks, dependencies, and schedule impacts while mentoring engineers.

Pay and Benefits

Perks:MedicalDentalVisionPaid LeavePaid Time-offPaid Holidays

Key Requirements

  • •15+ years of experience in DRAM, HBM, advanced memory, system-on-chip, or application-specific integrated circuit design roles.
  • •Proven experience delivering complex designs from architecture through silicon bring-up and post-silicon debug.
  • •Strong expertise in DRAM operation and JEDEC standards, preferably including HBM product families.
  • •Extensive experience with CMOS circuit design, transistor-level design, and semiconductor device physics.
  • •Demonstrated technical project leadership across multidisciplinary engineering teams.
Experience:15+ yearsDRAMHBMSemiconductorAI and ML
Skills:CommunicationMentoringLeadership
Tech Stack:HBMDRAMJEDECTSVRTL2GDSVerilogRegister Transfer LevelFastSpiceHSPICEThrough-silicon viasHybrid bondingInterposersCMOSAnalog modelingHigh-speed interfaces

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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