2027 Undergrad ASIC Package Engineering Co-op/Intern

AMD
San Jose, Santa Clara
Workplace: HybridInternshipUSD 64,064 - 96,096 annuallyFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["Analytical thinking","Data analysis","Problem-solving"]

Support ASIC package engineering by working with engineers on package design and development, including substrate, interposer, and bump designs for AMD products. Help implement and verify designs for performance, quality, and efficiency by analyzing yield and defect metrics. Evaluate and benchmark packaging materials, interact with partners, and contribute to the most cost-efficient designs that meet performance and yield requirements.

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FursaFursa
AMD
AMD
1 day ago

2027 Undergrad ASIC Package Engineering Co-op/Intern

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Last checked: 15 hours agoStatus: Live

Job Summary

Support ASIC package engineering by working with engineers on package design and development, including substrate, interposer, and bump designs for AMD products. Help implement and verify designs for performance, quality, and efficiency by analyzing yield and defect metrics. Evaluate and benchmark packaging materials, interact with partners, and contribute to the most cost-efficient designs that meet performance and yield requirements.
Location: San Jose, Santa Clara
Workplace: Hybrid
Employment Type: Internship
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Intern level

Key Responsibilities

  • •Support package design and package development engineers in prioritizing and optimizing new projects.
  • •Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
  • •Assist with design verification implementation to ensure performance, quality, and efficiency.
  • •Analyze yield and defect metrics to improve design performance and yield.
  • •Evaluate and benchmark packaging materials and interact with partners to meet cost, performance, and yield requirements.

Pay and Benefits

Salary: USD 64,064 - 96,096 annually

Key Requirements

  • •Currently enrolled in a US-based university in a Bachelors degree program in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
  • •Course related to transmission lines and electric circuits.
  • •Knowledge or experience with package, silicon, or PCB design software.
  • •Scripting languages: Perl, Python, or SQL.
  • •Data analytics and data visualization tools such as Power BI.
Experience:SemiconductorsASIC
Education:Bachelor's in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
Skills:Analytical thinkingData analysisProblem-solving
Languages:English
Tech Stack:PerlPythonSQLPower BI

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn