Package Engineering (PEPkg) Engineer
Taiwan
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringSkills: []Own package development, qualification, and customer support to enable successful release and ongoing sustainment of DRAM/NAND packages. Work within Micron’s Product Engineering environment focused on memory and storage solutions, ensuring packaging readiness across product lifecycles. Contribute to the reliability and delivery of packaged components that support Micron’s high-performance DRAM/NAND product portfolio.
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