Package Engineering (PEPkg) Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringSkills: []

Own package development, qualification, and customer support to enable successful release and ongoing sustainment of DRAM/NAND packages. Work within Micron’s Product Engineering environment focused on memory and storage solutions, ensuring packaging readiness across product lifecycles. Contribute to the reliability and delivery of packaged components that support Micron’s high-performance DRAM/NAND product portfolio.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Package Engineering (PEPkg) Engineer

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Last checked: 20 hours agoStatus: Live

Job Summary

Own package development, qualification, and customer support to enable successful release and ongoing sustainment of DRAM/NAND packages. Work within Micron’s Product Engineering environment focused on memory and storage solutions, ensuring packaging readiness across product lifecycles. Contribute to the reliability and delivery of packaged components that support Micron’s high-performance DRAM/NAND product portfolio.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Perform package development.
  • •Support package qualification.
  • •Provide customer support related to DRAM/NAND packages.
  • •Ensure successful product release for DRAM/NAND packages.
  • •Sustain DRAM/NAND package operations over the product lifecycle.

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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