Staff Engineer, APTD Photolithography

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 3+ yearsSkills: ["Cross-functional collaboration","Structured problem-solving","Data-driven analysis","Independent troubleshooting","Risk management"]

Develop and optimize photolithography processes for advanced packaging applications, focusing on thick and ultra-thick photoresist patterning. Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem-solving and statistical methods. Diagnose and resolve lithography process issues with failure analysis, FMEA, and SPC, while leading process/equipment/material evaluations to support qualification and manufacturing technology transfer.

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Micron Technology
Micron Technology
1 month ago

Staff Engineer, APTD Photolithography

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Job Summary

Develop and optimize photolithography processes for advanced packaging applications, focusing on thick and ultra-thick photoresist patterning. Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem-solving and statistical methods. Diagnose and resolve lithography process issues with failure analysis, FMEA, and SPC, while leading process/equipment/material evaluations to support qualification and manufacturing technology transfer.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize photolithography processes for advanced packaging applications, including thick and ultra-thick photoresist patterning.
  • •Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem-solving and statistical methods.
  • •Identify, diagnose, and resolve lithography-related process issues using failure analysis, FMEA, SPC, and related methodologies.
  • •Lead process, equipment, and material evaluations and support qualification and baseline changes.
  • •Collaborate with cross-functional teams and suppliers to enable robust integration and smooth technology transfer to manufacturing.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field.
  • •3+ years of experience in semiconductor photolithography or related process engineering.
  • •Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control.
  • •Experience applying DOE and SPC, using data-driven analysis to optimize processes.
  • •Ability to manage multiple priorities and resolve manufacturing line issues independently and collaboratively.
Experience:3+ yearsSemiconductor photolithographyAdvanced packagingBackend semiconductor technologiesHigh-aspect-ratio patterning
Skills:Cross-functional collaborationStructured problem-solvingData-driven analysisIndependent troubleshootingRisk management
Tech Stack:PhotolithographyThick photoresistUltra-thick photoresistDOESPCFMEAFailure analysisResist processingAlignmentOverlayCD controlLithography toolsTrack systemsMetrologyHigh-aspect-ratioWafer thinningPlasma dicingBonding

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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