Senior Thermal Engineer

Lead thermal invention and evaluation for next-generation photonic integrated circuits and co-packaged optical (CPO) platforms. Tackle electro-thermal and multi-physics challenges across chip, package, and system scales while collaborating with photonics, electrical IC, packaging, and reliability teams. Build and validate thermal models using Cadence Celsius and CFD tools, drive thermal co-design (heat sinks, cold plates, TIMs), and connect simulation results to silicon through experimental characterization and root-cause analysis.