Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceExperience: 5+ yearsEducation: bachelorsSkills: ["Problem-solving","Root cause analysis","Collaboration","Leadership","Communication"]

Lead reliability test flow development and qualification execution for Micron’s HBM products, covering DRAM and Interface die and stacked products. Drive DPM reduction (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategies. Identify and resolve qual/RMA failures using electric and physical failure analysis, improve fab processes, and support frontend process conversions to boost yield, cost, and cycle time. Mentor the team and manage technical risks while collaborating across HBM, Fab, TD, GQ, and Quality/Reliability.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM

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Last checked: 13 hours agoStatus: Live

Job Summary

Lead reliability test flow development and qualification execution for Micron’s HBM products, covering DRAM and Interface die and stacked products. Drive DPM reduction (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategies. Identify and resolve qual/RMA failures using electric and physical failure analysis, improve fab processes, and support frontend process conversions to boost yield, cost, and cycle time. Mentor the team and manage technical risks while collaborating across HBM, Fab, TD, GQ, and Quality/Reliability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Sr. Manager level

Key Responsibilities

  • •Define and develop reliability stress test flows, test plans, and coverage for all product reliability aspects.
  • •Work with the Global Quality team to define qualification plans, manage qualification execution progress, and resolve gating issues.
  • •Drive extrinsic reliability (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy to meet Quality, Cost, and Cycle Time KPIs.
  • •Debug and identify root causes of qual and RMA failures using electric failure analysis (EFA) and physical failure analysis (PFA), and drive resolution with cross-functional teams.
  • •Recommend process conversions to reduce cost and increase yield, manage risks with Product Managers/Leads, mentor team members, and collaborate cross-functionally on HBM manufacturing and reliability.
Travel: Medium travel

Key Requirements

  • •Bachelors/Masters in Electrical and Electronics Engineering with 5+ years of experience in the semiconductor industry.
  • •Strong technical skills in problem-solving with root-cause understanding through in-depth circuit analysis.
  • •Good knowledge of statistics and data analysis tools, plus scripting tools such as Python or JMP.
  • •Track record collaborating within/across teams to address complex business and engineering problems.
  • •Excellent communication and presentation skills, with an interest in people leadership, learning, and development.
Experience:5+ yearsSemiconductor industryProduct engineering
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingRoot cause analysisCollaborationLeadershipCommunication
Tech Stack:PythonJMP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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