Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Analytical thinking","Problem-solving","Communication","Leadership","Cross-functional collaboration"]

Develop and improve post-fab, wafer-level finishing processes for high-performance memory packaging, driving performance, cost, manufacturability, quality, reliability, and schedule outcomes. Establish wafer thinning and backside metal interconnect process technologies, evaluate equipment and materials, and advance quality via measurement, inspection, testing, SPC/DOE, and defect analysis. Coordinate with multiple engineering teams to transfer process of record/model of record documentation into high-volume manufacturing.

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FursaFursa
Micron Technology
Micron Technology
6 days ago

Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Develop and improve post-fab, wafer-level finishing processes for high-performance memory packaging, driving performance, cost, manufacturability, quality, reliability, and schedule outcomes. Establish wafer thinning and backside metal interconnect process technologies, evaluate equipment and materials, and advance quality via measurement, inspection, testing, SPC/DOE, and defect analysis. Coordinate with multiple engineering teams to transfer process of record/model of record documentation into high-volume manufacturing.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Develop and improve wafer-level process conditions and technologies (including wafer thinning and backside metal interconnect).
  • •Upgrade process capabilities and deliver technology node requirements and scaling for next node.
  • •Evaluate and promote new equipment and materials; set up semiconductor equipment process parameters.
  • •Improve quality through defense coverage via process/measurement/inspection/testing, correlations, and continuous data analysis.
  • •Coordinate across internal and external teams to integrate manufacturing processes and transition from new product development to high-volume production, including POR/MOR documentation.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceDentalVisionEquity

Key Requirements

  • •PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Semiconductor process development experience, preferably in wafer bonding, plating, warpage control, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Experience:Semiconductor manufacturingAIPackaging
Skills:Analytical thinkingProblem-solvingCommunicationLeadershipCross-functional collaboration
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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