Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceSkills: ["Problem-solving","Attention to detail","Team collaboration","Communication","Ownership"]

Develop and execute product reliability stress test flows and qualification plans for HBM-based memory products. Partner with the Global Quality team to drive qualification gating issue resolution and reduction of extrinsic and intrinsic reliability metrics (Time 0 and Field DPM). Perform root-cause analysis of quality/RMA device issues using EFA and PFA, support fab process conversions, and manage technical risks through cross-functional collaboration while identifying high-leverage AI use cases for reliability qualification.

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Micron Technology
Micron Technology
19 hours ago

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Develop and execute product reliability stress test flows and qualification plans for HBM-based memory products. Partner with the Global Quality team to drive qualification gating issue resolution and reduction of extrinsic and intrinsic reliability metrics (Time 0 and Field DPM). Perform root-cause analysis of quality/RMA device issues using EFA and PFA, support fab process conversions, and manage technical risks through cross-functional collaboration while identifying high-leverage AI use cases for reliability qualification.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance

Key Responsibilities

  • •Define and develop reliability stress test flows, test plans, and qualification coverage for product reliability.
  • •Collaborate with the Global Quality team to define qualification plans, manage qualification execution progress, and resolve qualification gating issues.
  • •Drive reductions in extrinsic reliability (Time 0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy.
  • •Debug and identify root causes of quality and RMA device issues using EFA and PFA, and drive improvements via cross-functional collaboration.
  • •Provide recommendations for fab process conversions affecting cost, yields, quality, reliability, and performance of HBM products while managing associated technical risks.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth InsuranceDentalVision

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
  • •Experience in semiconductor devices, circuit design, or product validation.
  • •Solid problem-solving methodologies focused on root-cause identification and exploring solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
Experience:Semiconductors
Education:
Skills:Problem-solvingAttention to detailTeam collaborationCommunicationOwnership
Tech Stack:PythonJMPCMOSDRAMHBMClaude codeAgentic AIAI platformsEFAPFA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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