NVIDIA

2 days ago

Senior Failure Analysis Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Join NVIDIA’s Physical Failure Analysis Lab to investigate complex semiconductor and system failures. You’ll pioneer advanced physical failure analysis techniques, including precision de-processing, Focused Ion Beam (FIB) preparation, and cutting-edge microscopy using SEM/TEM. Lead root-cause investigations impacting yield, performance, and reliability, and provide high-quality characterization data to engineering teams for DOE, design optimization, process improvements, and critical customer requests.

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Design and implement advanced failure analysis techniques and methodologies for root-cause investigations on leading-edge silicon and advanced packaging technologies.
•Perform precision de-processing, including mechanical cross-sectioning, parallel de-layering, and chemical/plasma de-processing across die, package, component, and board levels.
•Apply FIB sample preparation and advanced microscopy/inspection (SEM/TEM) to enable high-resolution electrical and physical diagnostics.
•Lead high-impact root-cause investigations to isolate causes impacting product yield, performance, and long-term reliability.
•Provide physical characterization data to support engineering teams with DOE evaluations, design optimization, process node improvements, and customer failure analysis requests.

Pay and Benefits

Salary: USD 144,000 - 230,000

Perks:EquityHealth Insurance

Key Requirements

•Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and failure analysis methodologies.
•Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
•Hands-on experience with optical and electron microscopy (SEM/TEM) and related analytical inspection techniques.
•Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
•B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or a closely related field, with 8+ years of relevant hands-on industry experience.

Experience:8+ years

Education:High School in Electrical Engineering, Materials Science, Physics (or closely related field)

Skills:Analytical thinkingProblem-solvingAttention to detail

Tech Stack:Focused Ion Beam (FIB)SEMTEMOptical microscopyMechanical cross-sectioningChemical/plasma de-processingDesign of Experiments (DOE)

Company Brief

NVIDIA

Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor

Loading job details...

Preparing the role view and application actions.

NVIDIA

2 days ago

Senior Failure Analysis Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Design and implement advanced failure analysis techniques and methodologies for root-cause investigations on leading-edge silicon and advanced packaging technologies.
•Perform precision de-processing, including mechanical cross-sectioning, parallel de-layering, and chemical/plasma de-processing across die, package, component, and board levels.
•Apply FIB sample preparation and advanced microscopy/inspection (SEM/TEM) to enable high-resolution electrical and physical diagnostics.
•Lead high-impact root-cause investigations to isolate causes impacting product yield, performance, and long-term reliability.
•Provide physical characterization data to support engineering teams with DOE evaluations, design optimization, process node improvements, and customer failure analysis requests.

Pay and Benefits

Salary: USD 144,000 - 230,000

Perks:EquityHealth Insurance

Key Requirements

•Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and failure analysis methodologies.
•Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
•Hands-on experience with optical and electron microscopy (SEM/TEM) and related analytical inspection techniques.
•Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
•B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or a closely related field, with 8+ years of relevant hands-on industry experience.

Experience:8+ years

Education:High School in Electrical Engineering, Materials Science, Physics (or closely related field)

Skills:Analytical thinkingProblem-solvingAttention to detail

Tech Stack:Focused Ion Beam (FIB)SEMTEMOptical microscopyMechanical cross-sectioningChemical/plasma de-processingDesign of Experiments (DOE)

Company Brief

NVIDIA

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor