Senior Director, Board Product Development Engineering

NVIDIA
Santa Clara
Workplace: OnsiteFull timeUSD 332,000 - 500,250 annuallyFunction: Executive & General ManagementExperience: 15+ yearsEducation: bachelorsSkills: ["Executive communication","Process building","Leadership","Cross-functional collaboration","Problem investigation"]

Oversee end-to-end integration readiness for next-generation datacenter board products, owning manufacturing and test readiness so schedules and target yields are met. Lead cross-domain techniques across chip-to-board boundaries (PCB & Fab, SMT/PCBA, and high-speed connector & signal integrity), define sign-off gates, and coordinate test coverage and diagnostic boards. Drive reliability and yield improvements by investigating excursions and partnering with CM/ODM/OSAT and PCB fabs worldwide.

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FursaFursa
NVIDIA
NVIDIA
3 days ago

Senior Director, Board Product Development Engineering

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Last checked: 3 hours agoStatus: Live

Job Summary

Oversee end-to-end integration readiness for next-generation datacenter board products, owning manufacturing and test readiness so schedules and target yields are met. Lead cross-domain techniques across chip-to-board boundaries (PCB & Fab, SMT/PCBA, and high-speed connector & signal integrity), define sign-off gates, and coordinate test coverage and diagnostic boards. Drive reliability and yield improvements by investigating excursions and partnering with CM/ODM/OSAT and PCB fabs worldwide.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Sr. Director level

Key Responsibilities

  • •Design, implement, and institutionalize an integration readiness process for next-generation datacenter board products, owning manufacturing and test readiness end to end.
  • •Guide functional teams to develop cross-boundary techniques before silicon and stackup freeze, focusing on warpage-tolerant DFM and reflow, impedance/CTE control, and early pad-map/fab method locking.
  • •Build, lead, and develop a global Board PDE organization across PCB & Fab, SMT/PCBA, and High-Speed Connector & Signal Integrity technical pillars.
  • •Set up integration oversight across the chip-to-board stack by defining entry/exit requirements and leading gates to confirm qualified domains can pass to the next.
  • •Collaborate with Operations Test Engineering and Signal Integrity to establish test coverage and manufacturing test flow requirements; investigate reliability and yield excursions to identify root causes and address DFx gaps.
Travel: Medium travel

Pay and Benefits

Salary: USD 332,000 - 500,250 annually
Equity and Bonus:Equity

Key Requirements

  • •BS in Electrical Engineering, Materials Science, or related technical field (or equivalent experience); MS or PhD is a plus.
  • •15+ overall years in product, manufacturing, or operations engineering for high-complexity electronics.
  • •8+ years leading engineering teams and 5+ years leading leaders in a global, cross-matrixed organization.
  • •Track record taking complex board and system products from design through NPI to high-volume manufacturing with ownership of schedule, yield, and quality outcomes.
  • •Comprehensive chip-to-board stack knowledge (advanced packaging/flip-chip BGA, high-density/high-layer-count PCB fabrication, SMT/assembly qualification, board-level reliability).
Experience:15+ yearsDatacenterElectronics manufacturingProduct developmentHigh-complexity electronics
Education:Bachelor's in Electrical Engineering, Materials Science, or related technical field
Skills:Executive communicationProcess buildingLeadershipCross-functional collaborationProblem investigation
Tech Stack:BERTChannel marginingStructural testFunctional test coverageDiagnostic boardsTester board developmentAdvanced packagingFlip-chip BGAHigh-density PCBHigh-layer-count PCB fabricationSMTSMT and assembly process qualificationImpedance controlCTE control112G224GFine-pitch BGA2.5D packaging3D packagingSerDes correlation

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
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