Applied Materials

3 weeks ago

Advanced Packaging Process Support Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Reposted: first listed 1 day ago

Job Summary

Provide high-visibility, customer-facing support for advanced semiconductor packaging equipment and processes, including on-site installation, qualification, troubleshooting, and process stabilization for KINEX bonding systems. Optimize die-to-wafer (hybrid) bonding processes, act as a process owner for hybrid bonding technologies, and design/execute DOE experiments. Analyze experimental data, perform root-cause analysis on complex equipment issues, and collaborate across customer and internal engineering teams to improve production yield.

Location: South Korea

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization.
•Support and optimize die-to-wafer bonding processes for advanced packaging applications.
•Act as a process owner for Hybrid Bonding technologies in collaboration with customer engineering teams.
•Design and execute process experiments/DOEs, analyze data, and deliver technical conclusions.
•Perform root cause analysis to resolve complex equipment and process issues and improve production yield.

Key Requirements

•Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or a related field.
•3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging.
•Ability to work in physically demanding fab environments with a strong sense of responsibility and diligence.
•Strong communication and interpersonal skills for global collaboration and technical documentation.
•Experience supporting complex process/equipment issues and resolving customer product problems using structured root cause analysis.

Experience:3-10 yearsSemiconductorAdvanced packagingSemiconductor process engineeringEquipment supportAdvanced semiconductor packaging

Education:Bachelor's

Skills:ResponsibilityDiligenceCommunicationInterpersonal skillsRoot cause analysis

Languages:English

Tech Stack:Hybrid BondingKINEXDie-to-wafer bondingWafer-to-wafer (Fusion bonding)Chemical Vapor DepositionAtomic Layer DepositionPlasma Reactive Ion EtchPhysical Vapor DepositionAnnealImplantDRY& WET cleaningPlasma-related processesPlasma cleaning

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

3 weeks ago

Advanced Packaging Process Support Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Reposted: first listed 1 day ago

Job Summary

Location: South Korea

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization.
•Support and optimize die-to-wafer bonding processes for advanced packaging applications.
•Act as a process owner for Hybrid Bonding technologies in collaboration with customer engineering teams.
•Design and execute process experiments/DOEs, analyze data, and deliver technical conclusions.
•Perform root cause analysis to resolve complex equipment and process issues and improve production yield.

Key Requirements

•Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or a related field.
•3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging.
•Ability to work in physically demanding fab environments with a strong sense of responsibility and diligence.
•Strong communication and interpersonal skills for global collaboration and technical documentation.
•Experience supporting complex process/equipment issues and resolving customer product problems using structured root cause analysis.

Experience:3-10 yearsSemiconductorAdvanced packagingSemiconductor process engineeringEquipment supportAdvanced semiconductor packaging

Education:Bachelor's

Skills:ResponsibilityDiligenceCommunicationInterpersonal skillsRoot cause analysis

Languages:English

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor