Senior/Principal Eng, FE OCT CPEE PHOTO EUV/DUV PROCESS

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5-8 yearsSkills: ["Data-driven problem-solving","Communication","Stakeholder management","Root-cause analysis","Cross-functional collaboration"]

Lead HVM photo yield, quality, productivity, and cost improvement initiatives, using data-driven root-cause analysis to resolve complex lithography/photo process issues. Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI, and act as the technical point of contact for cross-fab lithography concerns. Drive MOR–POR gap closure and cross-fab/node alignment while representing OCT Photo in reviews and governance forums.

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FursaFursa
Micron Technology
Micron Technology
2 days ago

Senior/Principal Eng, FE OCT CPEE PHOTO EUV/DUV PROCESS

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Last checked: 18 hours agoStatus: Live

Job Summary

Lead HVM photo yield, quality, productivity, and cost improvement initiatives, using data-driven root-cause analysis to resolve complex lithography/photo process issues. Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI, and act as the technical point of contact for cross-fab lithography concerns. Drive MOR–POR gap closure and cross-fab/node alignment while representing OCT Photo in reviews and governance forums.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead HVM photo yield, quality, productivity, and cost improvement initiatives.
  • •Resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching) using data-driven root-cause analysis.
  • •Define and deploy Photo Process Best Known Methods (BKM) across fabs for HVM and NPI.
  • •Serve as the technical point for cross-fab, complex lithography customer concerns.
  • •Drive MOR–POR gap closure and cross-fab/node alignment in collaboration with internal teams and suppliers.
Travel: Medium travel

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceEquityRecognition

Key Requirements

  • •BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or a related field.
  • •5+ years (Senior) or 8+ years (Principal) semiconductor photolithography experience in NPI/HVM manufacturing.
  • •Hands-on photo process engineering experience focused on yield, quality, productivity, and cost improvement.
  • •Proven problem-solving experience across overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching.
  • •Experience defining and deploying Best Known Methods (BKM) across tools, nodes, or fabs.
Experience:5-8 yearsSemiconductorPhotolithographyNPIHVMManufacturing
Education:
Skills:Data-driven problem-solvingCommunicationStakeholder managementRoot-cause analysisCross-functional collaboration
Tech Stack:AIAI-assisted toolsAI-enabled tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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