Sr. Module Engineer, Hybrid Bonding

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 147,000 - 202,500Function: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Technical leadership","Problem-solving","Hands-on laboratory mindset","Cross-functional communication","Technology transfer"]

Develop and scale die-to-wafer hybrid bonding technologies for advanced semiconductor packaging. You’ll lead process module development across surface preparation, plasma activation, die placement, hybrid bonding, post-bond characterization, yield improvement, and manufacturing scale-up. The role combines metrology and failure analysis (e.g., CSAM, X-ray inspection, FIB/SEM, AFM) with reliability testing and DOE/statistical process control to improve electrical performance and reliability while transferring R&D concepts into manufacturing.

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Applied Materials
Applied Materials
1 day ago

Sr. Module Engineer, Hybrid Bonding

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Job Summary

Develop and scale die-to-wafer hybrid bonding technologies for advanced semiconductor packaging. You’ll lead process module development across surface preparation, plasma activation, die placement, hybrid bonding, post-bond characterization, yield improvement, and manufacturing scale-up. The role combines metrology and failure analysis (e.g., CSAM, X-ray inspection, FIB/SEM, AFM) with reliability testing and DOE/statistical process control to improve electrical performance and reliability while transferring R&D concepts into manufacturing.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize die-to-wafer hybrid bonding processes, establishing process windows across surface preparation, plasma activation, die placement/alignment, bonding optimization, and post-bond annealing.
  • •Drive Cu-Cu and dielectric-dielectric interconnect formation, focusing on electrical performance and reliability.
  • •Integrate hybrid bonding into memory architectures, chiplets, silicon interposers, system-on-wafer platforms, and co-packaged optics, resolving process interactions and yield excursions.
  • •Use metrology and characterization (CSAM, X-ray, FIB/SEM, AFM, optical metrology) to correlate process parameters with package performance.
  • •Define reliability test plans and lead failure analysis/corrective actions while mentoring junior engineers and presenting progress to leadership/customers.
Travel: Low travel

Pay and Benefits

Salary: USD 147,000 - 202,500
Equity and Bonus:Equity

Key Requirements

  • •M.S. (or Ph.D.) in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing, with relevant semiconductor process background.
  • •5+ years of semiconductor process development experience after graduate degree.
  • •Direct experience in hybrid bonding (including thermocompression/wafer bonding), advanced packaging, and areas such as HBM development or Cu interconnect technology.
  • •Strong knowledge of Cu-Cu interconnect formation, surface chemistry/plasma activation, and CMP/planarization, plus semiconductor process integration.
  • •Experience with DOE and statistical process analysis tools (e.g., JMP/Minitab) and familiarity with metrology and failure analysis techniques.
Experience:5+ yearsSemiconductor manufacturingAdvanced packagingHBM3D stackingHybrid bonding
Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Semiconductor Manufacturing
Skills:Technical leadershipProblem-solvingHands-on laboratory mindsetCross-functional communicationTechnology transfer
Tech Stack:Hybrid bondingDie-to-wafer (D2W)Cu-Cu interconnect formationDielectric-dielectric direct bondingPlasma activationCMPPlanarizationDOEJMPMinitabCSAMX-ray inspectionFIB/SEMAFMOptical metrologyElectrical test structuresThermal cyclingHTOLMoisture sensitivity evaluationsMechanical pull/shear testing

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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