Director, Process Engineer – Dry Etch

Lead dry etch process engineering within MDCE to improve process capability and manufacturability across advanced CMOS nodes. Drive development, optimization, and sustaining of etch modules (e.g., plasma etch, RIE, ALE, conductor/dielectric/thermal etch) to achieve safety, yield, defectivity, throughput, profile control, and cost targets. Collaborate across integration, lithography, thin films, cleans, yield/defect metrology, factories, and suppliers to deliver robust solutions aligned to the technology roadmap.