Director, Process Engineer – Dry Etch

Intel
United States
Workplace: HybridFull timeUSD 211,400 - 298,440 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsEducation: mastersSkills: ["Problem-solving","Data analysis","Engineering judgment","Collaboration","Communication"]

Lead dry etch process engineering for Intel Foundry’s high-volume manufacturing transformation. Drive development, optimization, and sustaining of dry etch modules (e.g., plasma etch, RIE, ALE, conductor/dielectric/thermal etch) to improve safety, quality, performance, throughput, yield, defectivity, and cost. Own experiments and data-driven troubleshooting, partner with internal integration, metrology, yield, equipment, factory, and suppliers to deliver roadmap-ready etch solutions and process transfers.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
2 months ago

Director, Process Engineer – Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 8 hours agoStatus: Live
Reposted: similar role first listed 1 week ago

Job Summary

Lead dry etch process engineering for Intel Foundry’s high-volume manufacturing transformation. Drive development, optimization, and sustaining of dry etch modules (e.g., plasma etch, RIE, ALE, conductor/dielectric/thermal etch) to improve safety, quality, performance, throughput, yield, defectivity, and cost. Own experiments and data-driven troubleshooting, partner with internal integration, metrology, yield, equipment, factory, and suppliers to deliver roadmap-ready etch solutions and process transfers.
Location: United States
Workplace: Hybrid
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Director level

Key Responsibilities

  • •Lead the intersection of technology development and high-volume manufacturing for new or transferred dry etch processes.
  • •Plan and execute process experiments; analyze data to resolve tool and process issues and drive technical closure.
  • •Improve safety, quality, performance, throughput, process capability, profile control, CD uniformity, selectivity, defectivity, yield, and cost.
  • •Partner with internal teams (Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, Quality/Reliability) and factories to deliver roadmap-ready etch solutions.
  • •Collaborate with dry etch equipment and process suppliers on chamber matching, hardware/process improvements, and productivity/defectivity reductions.

Pay and Benefits

Salary: USD 211,400 - 298,440 annually
Equity and Bonus:Equity
Perks:Health InsuranceLife InsuranceDisability InsuranceRetirementWellness StipendEquity

Key Requirements

  • •10+ years of semiconductor industry experience focused on dry etch process development, process integration, or HVM support.
  • •Master’s degree in an engineering/science field (Electrical, Chemical, Mechanical, Materials Science, Physics, Chemistry, or related).
  • •Hands-on experience with dry etch process development, plasma etch equipment, recipe optimization, process characterization, and troubleshooting.
  • •Proven collaboration across process modules, integration teams, equipment engineering, manufacturing, yield, defect metrology, and external suppliers.
  • •Ability to operate in a dynamic fab environment, support urgent manufacturing issues, and drive technical closure under schedule pressure.
Experience:10+ yearsSemiconductorDry etchProcess integrationHigh-volume manufacturingSemiconductor foundry
Education:Master's
Skills:Problem-solvingData analysisEngineering judgmentCollaborationCommunication
Tech Stack:Dry etchPlasma processingPlasma chemistryReactive ion etch (RIE)Atomic layer etch (ALE)Conductor etchDielectric etchThermal etchMetrologyCD-SEMStatistical process control (SPC)Design of experiments (DOE)Defect inspectionOverlayElectrical testYield data

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor