Package Characterization Lab Manager, APTD

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Laboratory & Clinical OperationsExperience: 8+ yearsEducation: bachelorsSkills: ["Technical leadership","People management","Mentorship","Continuous improvement","Communication"]

Lead Advanced Packaging Technology Development (APTD) package characterization and failure analysis (FA) lab operations, managing a team of shift engineers and technicians. Own lab operational excellence, safety, compliance, equipment uptime, and lab capability planning. Provide technical leadership to improve FA methodologies, benchmark cross-site practices, and deliver actionable package analysis insights to support APTD technology decisions, while building workforce training and performance management programs.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Package Characterization Lab Manager, APTD

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Last checked: 18 hours agoStatus: Live

Job Summary

Lead Advanced Packaging Technology Development (APTD) package characterization and failure analysis (FA) lab operations, managing a team of shift engineers and technicians. Own lab operational excellence, safety, compliance, equipment uptime, and lab capability planning. Provide technical leadership to improve FA methodologies, benchmark cross-site practices, and deliver actionable package analysis insights to support APTD technology decisions, while building workforce training and performance management programs.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Laboratory & Clinical Operations
Seniority: Manager level

Key Responsibilities

  • •Lead package characterization lab operations to meet performance metrics, cycle-time, and safety standards.
  • •Plan and optimize FA lab equipment, space, and budget; coordinate calibration, repairs, and spare parts procurement to ensure equipment uptime.
  • •Evaluate and introduce new FA tool models and capabilities with vendors and Micron subject-matter experts.
  • •Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures across cross-site partners.
  • •Build and sustain workforce training and development, define performance metrics, and provide coaching and career development for lab engineers and technicians.

Key Requirements

  • •Bachelor’s degree or higher (Master’s/PhD preferred) in Materials Science, Physics, Chemistry, or a related field.
  • •8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis.
  • •Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering, and decapsulation.
  • •Knowledge of semiconductor or advanced packaging manufacturing processes.
  • •Experience in lab management, shift resource planning, budgeting, and proven technical leadership with people management capability.
Experience:8+ yearsSemiconductorAdvanced packagingFailure analysis
Education:Bachelor's in Materials Science, Physics, Chemistry
Skills:Technical leadershipPeople managementMentorshipContinuous improvementCommunication
Tech Stack:SEMEDXFIBTEMAFMFTIRXPSX-rayCSAMIon millingDelayeringDecapsulationISO14001OHSASEHS

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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