Device and Process Integration Engineer

Drive continual improvement of process technologies in a state-of-the-art 300mm analog and embedded wafer fab in Lehi. Apply semiconductor device physics to deliver process and parametric improvements, owning parametric performance and Cpk gains. Lead experiments, characterization, test, data analysis, and simulation work, including root cause analysis for scrap/outliers, while collaborating across integration, reliability, packaging, test, and product teams to qualify and manufacture advanced technologies.