Integrated Circuit - Packaging Architect Engineer

AMD
San Jose
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: phdSkills: ["Communication","Leadership","Problem-solving"]

Advanced packaging technology leader responsible for defining packaging architectures across client, server, gaming and GPU products. Leads cross-functional teams, drives technology development from concept to qualifications, defines packaging roadmaps with DFM/DFY guidelines, and communicates progress to AMD management while engaging with global partners to identify innovative solutions.

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FursaFursa
AMD
AMD
1 month ago

Integrated Circuit - Packaging Architect Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Advanced packaging technology leader responsible for defining packaging architectures across client, server, gaming and GPU products. Leads cross-functional teams, drives technology development from concept to qualifications, defines packaging roadmaps with DFM/DFY guidelines, and communicates progress to AMD management while engaging with global partners to identify innovative solutions.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering

Key Responsibilities

  • •Work with product architects in early definition stage to understand and define package architectures, roadmap
  • •Lead new package technology development initiatives from concept to full technology qualification
  • •Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
  • •Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Key Requirements

  • •BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent
  • •Experience leading engineering teams in architecture definition, process definition and/or yield improvement
  • •Strong communication skills to share complex technical signals with partners and management
  • •Experience with Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines
  • •Proven track record in semiconductor technology development and working with manufacturing partners
Experience:SemiconductorPackaging
Education:PhD / Doctorate
Skills:CommunicationLeadershipProblem-solving
Languages:English
Tech Stack:DFMDFYPackagingMaterial scienceThin film process development

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn