Mechanical Engineer

AMD
San Jose
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesEducation: mastersSkills: ["Collaboration","Technical problem-solving","Cross-functional teamwork"]

Build mechanical design solutions for advanced semiconductor packaging and cooling technologies for AI, HPC, FPGA, ASIC, and SoC products. Own mechanical CAD modeling, tolerance analysis, fit checks, and DFM reviews, then collaborate with suppliers and contract manufacturers to define manufacturable design requirements. Evaluate designs and engineering changes for product quality, and support thermo-mechanical modeling and package integration using Creo and ANSYS Mechanical across chip/package/board/system levels.

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FursaFursa
AMD
AMD
1 day ago

Mechanical Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live
Reposted: similar role first listed 2 months ago

Job Summary

Build mechanical design solutions for advanced semiconductor packaging and cooling technologies for AI, HPC, FPGA, ASIC, and SoC products. Own mechanical CAD modeling, tolerance analysis, fit checks, and DFM reviews, then collaborate with suppliers and contract manufacturers to define manufacturable design requirements. Evaluate designs and engineering changes for product quality, and support thermo-mechanical modeling and package integration using Creo and ANSYS Mechanical across chip/package/board/system levels.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades

Key Responsibilities

  • •Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
  • •Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews.
  • •Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
  • •Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability.
  • •Support thermo-mechanical modeling and package integration activities and contribute to chip, package, board, and system-level integration efforts.

Key Requirements

  • •Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products.
  • •Experience with mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
  • •Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools.
  • •Understanding of chip-package interaction, package-board interaction, and semiconductor package integration.
  • •Experience working with suppliers, contract manufacturers, or packaging development partners.
Experience:Semiconductor packagingAIHPCASICSoCFPGAManufacturing
Education:Master's in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or related technical field
Skills:CollaborationTechnical problem-solvingCross-functional teamwork
Languages:English
Tech Stack:CAD modelingCreoANSYS MechanicalGD&TDFMThermo-mechanical modeling

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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