Design Architecture, Principal Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Architecture & Urban PlanningEducation: bachelorsSkills: ["Communication","Cross-functional collaboration","Problem-solving","Continuous improvement"]

Drive exploration and definition of next-generation AI memory and system environments. Analyze emerging compute, networking, and storage infrastructure trends, lead HBM architecture analysis (bandwidth/latency targets and constraints), and build simulation frameworks to model AI cluster performance and memory behavior. Create performance models and trend dashboards from benchmarks to guide architectural trade-offs. Partner across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable intercept strategies and roadmap influence.

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FursaFursa
Micron Technology
Micron Technology
1 day ago

Design Architecture, Principal Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Drive exploration and definition of next-generation AI memory and system environments. Analyze emerging compute, networking, and storage infrastructure trends, lead HBM architecture analysis (bandwidth/latency targets and constraints), and build simulation frameworks to model AI cluster performance and memory behavior. Create performance models and trend dashboards from benchmarks to guide architectural trade-offs. Partner across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable intercept strategies and roadmap influence.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Architecture & Urban Planning
Seniority: Sr. Manager level

Key Responsibilities

  • •Research and synthesize trends in compute, networking, and storage infrastructure to anticipate how future AI systems evolve.
  • •Lead HBM architecture analysis by defining bandwidth/latency targets, identifying constraints, and translating workload and system data into memory requirements.
  • •Develop and maintain simulation frameworks to model AI cluster performance and memory subsystem behavior, validating against benchmarks.
  • •Build first-order performance models (HBM bandwidth/latency, GPU/CPU interactions, and memory hierarchy trade-offs) to guide architectural decisions.
  • •Create and curate trend dashboards and partner with DTPCO, Design, and Product/System teams to align requirements and influence roadmaps.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science or related field (or equivalent practical experience).
  • •Strong understanding of materials and technology challenges across hybrid computing systems.
  • •Experience with memory subsystem design (HBM, DDR, caches) and how memory behavior affects AI/ML workloads and system bottlenecks.
  • •Experience in Fab & Foundry environments and memory-related manufacturing context.
  • •Build performance models and simulation approaches to support HBM architecture decisions and system-level trade-offs.
Experience:AI/MLSemiconductorMemoryFab & FoundryMicroelectronics
Education:Bachelor's
Skills:CommunicationCross-functional collaborationProblem-solvingContinuous improvement
Tech Stack:HBMDDRGPUCPUSimulation frameworks

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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