Packaging Engineering Intern MS/PhD

Texas Instruments
Dallas
Workplace: OnsiteInternshipFunction: Research & Scientific (R&D)Education: mastersSkills: ["Written communication","Verbal communication","Analytical thinking","Problem solving","Team collaboration"]

Work on semiconductor packaging technologies for TI’s analog and embedded processing products, collaborating with cross-functional teams to develop internal and external solutions. Support design, development, and analysis across advanced packaging formats (wirebond, flip chip, modules, SIPs) and contribute to material, mechanical, thermal, and electrical characterization to advance miniaturization, integration, reliability, performance, and low power.

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FursaFursa
Texas Instruments
Texas Instruments
1 week ago

Packaging Engineering Intern MS/PhD

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Last checked: 49 minutes agoStatus: Live

Job Summary

Work on semiconductor packaging technologies for TI’s analog and embedded processing products, collaborating with cross-functional teams to develop internal and external solutions. Support design, development, and analysis across advanced packaging formats (wirebond, flip chip, modules, SIPs) and contribute to material, mechanical, thermal, and electrical characterization to advance miniaturization, integration, reliability, performance, and low power.
Location: Dallas
Workplace: Onsite
Employment Type: Internship
Job Function: Research & Scientific (R&D)
Seniority: Intern level

Key Responsibilities

  • •Interface across organizations to support the design, development, and analysis of semiconductor packaging technologies.
  • •Participate in cross-functional teams to develop internal and external solutions for packaging technologies across readiness stages.
  • •Contribute to packaging advancements through material, mechanical, thermal, and electrical characterization.
  • •Support development of advanced package types including wirebond, flip chip, modules, and SIPs.
  • •Work with semiconductor fabrication and characterization tools (e.g., VI Scopes, X-ray inspection, materials characterization, and FA techniques).

Key Requirements

  • •Currently pursuing a Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering, or a related field.
  • •Cumulative 3.0/4.0 GPA or higher.
  • •Coursework or research in semiconductor packaging/fabrication.
  • •Experience with AutoCAD design and FEM modeling.
  • •Ability to collaborate across functions and communicate effectively.
Experience:Semiconductors
Education:Master's in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering, or related
Skills:Written communicationVerbal communicationAnalytical thinkingProblem solvingTeam collaboration
Tech Stack:AutoCADFEM modelingHeat transferThermodynamicsStress analysisCVDPVDThin film depositionElectroplatingPlasma etchMEMS3D integrationML based package designWafer bumpingOptical packagingPlatingAdhesionSurface treatment processVI ScopesX-ray inspection

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn