Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementEducation: bachelorsSkills: ["Collaboration","Intellectual curiosity","Results orientation","Clear communication","Adaptability"]

Develop, optimize, and qualify semiconductor packaging assembly processes and equipment for quality, reliability, yield, and cost targets. Use Design of Experiments (DOE) and Statistical Process Control (SPC) to run experimental design and process characterization, and innovate techniques, materials, and tools to improve packaging performance. Partner with suppliers and cross-functional teams to manage technical risk, document results, and standardize process flows across Intel sites in Chandler, Arizona.

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FursaFursa
Intel
Intel
4 days ago

Packaging Module Development Engineer

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Last checked: 4 hours agoStatus: Live

Job Summary

Develop, optimize, and qualify semiconductor packaging assembly processes and equipment for quality, reliability, yield, and cost targets. Use Design of Experiments (DOE) and Statistical Process Control (SPC) to run experimental design and process characterization, and innovate techniques, materials, and tools to improve packaging performance. Partner with suppliers and cross-functional teams to manage technical risk, document results, and standardize process flows across Intel sites in Chandler, Arizona.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Entry level

Key Responsibilities

  • •Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
  • •Lead experimental design and process characterization using DOE and SPC methodologies.
  • •Innovate new techniques, materials, and tools to address packaging quality and reliability challenges.
  • •Collaborate cross-functionally to identify and mitigate technical risks across product development milestones.
  • •Establish specifications for materials and equipment with suppliers, document findings, and drive standardization across Intel sites.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s, Master’s, or PhD in engineering, Physics, Chemistry, or related STEM fields with 6+ months of relevant industry experience (or PhD with relevant field).
  • •Experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
  • •Hands-on experience in process development, equipment qualification, and characterization in a packaging or manufacturing environment.
  • •Data analysis and risk assessment capabilities for informed technical decision-making.
  • •Preferred: experience leading technical teams across matrixed organizations, and knowledge of semiconductor fabrication processes and packaging flows.
Education:Bachelor's in Engineering, Physics, Chemistry (or related STEM field)
Skills:CollaborationIntellectual curiosityResults orientationClear communicationAdaptability
Tech Stack:Design of Experiments (DOE)Statistical Process Control (SPC)Process characterizationProcess developmentEquipment qualificationData analysisRisk assessmentMachine visionAutomated inspectionCamera-based measurementPythonMATLABSQL

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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