Director, Advanced Packaging Lab (HIT)

AMD
Singapore
Workplace: OnsiteFull timeFunction: Laboratory & Clinical OperationsEducation: bachelorsSkills: ["Leadership","Communication","Stakeholder management","Team building","Partnership development"]

Lead the Singapore Advanced Packaging Lab within AMD's HIT program, building and scaling a multidisciplinary team to advance metrology and characterization across optical, electrical, mechanical, thermal, and imaging domains, while partnering with suppliers, universities, and industry collaborators to accelerate AMD’s AI packaging roadmap.

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FursaFursa
AMD
AMD
4 months ago

Director, Advanced Packaging Lab (HIT)

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Last checked: 4 hours agoStatus: Live

Job Summary

Lead the Singapore Advanced Packaging Lab within AMD's HIT program, building and scaling a multidisciplinary team to advance metrology and characterization across optical, electrical, mechanical, thermal, and imaging domains, while partnering with suppliers, universities, and industry collaborators to accelerate AMD’s AI packaging roadmap.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Laboratory & Clinical Operations
Seniority: Director level

Key Responsibilities

  • •Build and lead a multidisciplinary team to establish and scale advanced measurement and characterization capabilities across optical, electrical, mechanical, thermal, and imaging domains.
  • •Define and execute the lab’s technical roadmap in alignment with AMD’s AI packaging strategy.
  • •Build and scale a high-performing team with deep domain expertise across metrology and characterization.
  • •Drive collaboration with global engineering teams and external partners to accelerate capability development.
  • •Establish partnerships with equipment vendors, research institutions, and ecosystem partners to enable innovation in measurement technologies.

Key Requirements

  • •Bachelor’s or Master’s in Mechanical / Electrical Engineering, Materials Science, Physics or equivalent.
  • •Extensive experience in advanced packaging, metrology, characterization, and design validation of semiconductor components and packages.
  • •Hands-on experience in optical, electrical, mechanical, thermal, or imaging metrology with ability to apply to cross-disciplinary challenges.
  • •Proven track record building, scaling, and leading technical teams; strong network within the Singapore tech ecosystem.
  • •Excellent written and spoken English; ability to engage and influence cross-functional and external partners.
Experience:SemiconductorAdvanced packagingMetrologyLab leadershipTeam scaling
Education:Bachelor's
Skills:LeadershipCommunicationStakeholder managementTeam buildingPartnership development
Languages:English
Tech Stack:OpticalImagingSpectroscopyX-ray imagingMetrologyMaterials characterization

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn