Director, Advanced Packaging Lab (HIT)
AMD
Singapore
Workplace: OnsiteFull timeFunction: Laboratory & Clinical OperationsEducation: bachelorsSkills: ["Leadership","Communication","Stakeholder management","Team building","Partnership development"]Lead the Singapore Advanced Packaging Lab within AMD's HIT program, building and scaling a multidisciplinary team to advance metrology and characterization across optical, electrical, mechanical, thermal, and imaging domains, while partnering with suppliers, universities, and industry collaborators to accelerate AMD’s AI packaging roadmap.

