Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: bachelorsSkills: ["Logical thinking","Model-based problem solving","Data-driven decision making","Presentation skills","Organizational skills","Teamwork","Communication","Multitasking","Interpersonal skills"]

Own end-to-end structural uniformity and cross-loop integration for critical semiconductor modules, driving yield, quality, and reliability improvements. Build model-based root cause analysis frameworks and strengthen inline monitoring and defense lines to control structural uniformity. Lead global product integration programs, standardize best-known methods across sites, and re-engineer processes to improve benchmark performance, cycle time, and development productivity.

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FursaFursa
Micron Technology
Micron Technology
4 months ago

Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

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Last checked: 7 hours agoStatus: Live

Job Summary

Own end-to-end structural uniformity and cross-loop integration for critical semiconductor modules, driving yield, quality, and reliability improvements. Build model-based root cause analysis frameworks and strengthen inline monitoring and defense lines to control structural uniformity. Lead global product integration programs, standardize best-known methods across sites, and re-engineer processes to improve benchmark performance, cycle time, and development productivity.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead process integration (PI) structural uniformity and cross-loop integration for critical modules, owning end-to-end integration strategies to address yield, quality, and reliability gaps.
  • •Develop physics- and process-based integration solutions in collaboration with cross-module process owners, PI SMEs, and suppliers to achieve BIC yield and quality targets.
  • •Create and apply model-based root cause analysis frameworks to diagnose structural non-uniformity.
  • •Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to control structural uniformity.
  • •Own product integration programs and drive shift-left integration, leading global technical alignment by standardizing and scaling network BKMs across sites; identify process efficiency gaps and lead process optimization/re-engineering.

Key Requirements

  • •More than 5 years of semiconductor industry experience/knowledge.
  • •Bachelors/Masters/PhD in EE, Materials Engineering, Materials Science, Physics, or Chemical, or optional with 8+ years in a process-related semiconductor role.
  • •Understanding of DRAM and NAND operation and structure to interpret parametric/probe/qualification data across front-end and backend assembly processes.
  • •Knowledge of semiconductor fabrication process flows and how process interactions affect yield, device performance, and reliability.
  • •Good logical thinking and model-based, data-driven problem solving with presentation skills; strong troubleshooting and root-cause ability.
Experience:5+ yearsSemiconductor industry
Education:Bachelor's in EE, Materials Engineering, Materials Science, Physics and Chemical
Skills:Logical thinkingModel-based problem solvingData-driven decision makingPresentation skillsOrganizational skillsTeamworkCommunicationMultitaskingInterpersonal skills
Tech Stack:DRAMNANDModel-based root cause analysisInline monitoringDefense linesCDFilm lossMass deltaDefectivityEdge/periphery metricsBKMs

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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