HBM Advanced Package Process / Equipment Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: bachelorsSkills: ["Continuous improvement","Process optimization","Root cause analysis","Abnormal analysis","Data-driven problem-solving"]

Own and sustain bond and debond process operations while ensuring process stability through maintenance, parameter setup, and continuous improvement. Upgrade equipment/tool capability to raise product quality and lead process management projects. Evaluate and promote new equipment/materials, perform abnormal analysis, and improve outcomes using AI and data analytics for monitoring, root-cause identification, predictive maintenance, and process optimization in semiconductor manufacturing.

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Micron Technology
Micron Technology
3 weeks ago

HBM Advanced Package Process / Equipment Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Own and sustain bond and debond process operations while ensuring process stability through maintenance, parameter setup, and continuous improvement. Upgrade equipment/tool capability to raise product quality and lead process management projects. Evaluate and promote new equipment/materials, perform abnormal analysis, and improve outcomes using AI and data analytics for monitoring, root-cause identification, predictive maintenance, and process optimization in semiconductor manufacturing.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Accountable for sustaining the bond process and backing up debond area process basic maintenance.
  • •Establish and improve process conditions and technology; upgrade tool capability to improve product quality.
  • •Establish and modify process management projects; set process parameters for semiconductor equipment.
  • •Evaluate, promote, and plan new equipment and materials for manufacturing operations.
  • •Use AI and data analytics for process monitoring, root cause analysis, predictive maintenance, and process optimization.

Key Requirements

  • •Preferred 3+ years of working experience in a production line environment.
  • •Process maintenance experience required.
  • •Bachelor’s degree or above.
  • •Experience accountable for sustaining bond process and supporting debond area maintenance.
  • •Ability to establish and improve process conditions, parameters, and process management projects.
Experience:3+ yearsSemiconductor manufacturing
Education:Bachelor's
Skills:Continuous improvementProcess optimizationRoot cause analysisAbnormal analysisData-driven problem-solving
Tech Stack:AIData analyticsPredictive maintenance

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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