Director Pathfinder Solutions - Integrated Materials Solutions

Applied Materials
New York
Workplace: OnsiteFull timeUSD 200,000 - 275,000Function: Executive & General ManagementExperience: 10+ yearsEducation: phdSkills: ["Analytical","Problem-solving","Communication","Technical peer engagement"]

Lead the development of integrated semiconductor process “pathfinding” solutions for next-generation logic and memory device architectures. Serve as a deep technical, hands-on expert spanning process engineering, device physics, and materials science, coordinating cross-BU experiments, DTCO analysis, and wafer-flow data work. Engage credibly with senior customer technologists, present in key technology review forums, and influence product roadmaps through demonstrated technical insights.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Applied Materials
Applied Materials
4 days ago

Director Pathfinder Solutions - Integrated Materials Solutions

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Lead the development of integrated semiconductor process “pathfinding” solutions for next-generation logic and memory device architectures. Serve as a deep technical, hands-on expert spanning process engineering, device physics, and materials science, coordinating cross-BU experiments, DTCO analysis, and wafer-flow data work. Engage credibly with senior customer technologists, present in key technology review forums, and influence product roadmaps through demonstrated technical insights.
Location: New York
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and/or memory (DRAM 4F2, 3D DRAM, NAND) device architectures.
  • •Drive hands-on process development across deposition, etch, implant, epitaxy, CMP, and thermal processing, connecting steps into integrated module flows.
  • •Identify and de-risk critical process challenges for N+1 and N+2 nodes through experimentation and DTCO analysis; translate device performance targets into actionable process solutions.
  • •Coordinate end-to-end process flows across product Business Units and collaborate with DTCO for integration-level analysis connecting process capabilities to device-level performance metrics.
  • •Engage directly with senior customer technologists and lead technical discussions in TRMs, performance task forces, and pathfinding workshops; translate customer challenges into development programs and demo plans.
Travel: Low travel

Pay and Benefits

Salary: USD 200,000 - 275,000

Key Requirements

  • •Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline.
  • •10+ years of experience in semiconductor process development, integration, or device engineering with deep expertise in FEOL, MOL, or BEOL process technologies.
  • •Hands-on track record developing integrated process solutions for advanced logic and/or memory nodes.
  • •Strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio.
  • •Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers).
Experience:10+ years
Education:PhD / Doctorate in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline
Skills:AnalyticalProblem-solvingCommunicationTechnical peer engagement
Tech Stack:UnixTclSystems AnalysisSystem AdministrationUnix Systems

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
WebsiteLinkedInGlassdoor