Process Engineer II - Office of the CTO

Design, optimize, and maintain laboratory-scale semiconductor advanced packaging processes, including wafer-level packaging, flip-chip, and 3D integration. Conduct lab-based photolithography and advanced packaging process experiments, collect and analyze data, characterize hardware, and troubleshoot complex issues using root cause analysis. Prepare internal/external technical documentation and interact with customers to resolve process engineering concerns while collaborating with cross-functional R&D teams and working with vendors to implement new technologies and analytical instrumentation.