Process Engineer II - Office of the CTO

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 100,000 - 136,500 annuallyFunction: Industrial, Process & Manufacturing EngineeringSkills: ["Problem-solving","Data analysis","Technical documentation","Cross-functional collaboration"]

Design, optimize, and maintain laboratory-scale semiconductor advanced packaging processes, including wafer-level packaging, flip-chip, and 3D integration. Conduct lab-based photolithography and advanced packaging process experiments, collect and analyze data, characterize hardware, and troubleshoot complex issues using root cause analysis. Prepare internal/external technical documentation and interact with customers to resolve process engineering concerns while collaborating with cross-functional R&D teams and working with vendors to implement new technologies and analytical instrumentation.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Applied Materials
Applied Materials
2 months ago

Process Engineer II - Office of the CTO

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Design, optimize, and maintain laboratory-scale semiconductor advanced packaging processes, including wafer-level packaging, flip-chip, and 3D integration. Conduct lab-based photolithography and advanced packaging process experiments, collect and analyze data, characterize hardware, and troubleshoot complex issues using root cause analysis. Prepare internal/external technical documentation and interact with customers to resolve process engineering concerns while collaborating with cross-functional R&D teams and working with vendors to implement new technologies and analytical instrumentation.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop, optimize, and maintain laboratory-scale processes for semiconductor advanced packaging.
  • •Conduct photolithography process development experiments and measure film properties, then analyze/interpret results.
  • •Perform hardware characterization and troubleshoot complex issues using root cause analysis.
  • •Generate internal and external documentation, presentations, and technical reports.
  • •Collaborate with customers, vendors, and suppliers to implement new technologies, products, and analytical instrumentation.
Travel: Medium travel

Pay and Benefits

Salary: USD 100,000 - 136,500 annually
Equity and Bonus:Equity

Key Requirements

  • •Hands-on semiconductor packaging and/or semiconductor fabrication experience in academia and/or industry.
  • •Expertise in lithography, wet chemical etch/clean, and dry film lamination (preferred).
  • •Ability to conduct lab-based experiments to evaluate and improve advanced packaging processes within safety guidelines.
  • •Experience optimizing and sustaining photolithography processes for advanced packaging.
  • •Capability to troubleshoot complex process engineering issues using root cause analysis and sound engineering judgment.
Experience:Semiconductor manufacturingSemiconductor packagingAdvanced packagingLithographyR&D
Skills:Problem-solvingData analysisTechnical documentationCross-functional collaboration

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
WebsiteLinkedInGlassdoor