Principal Engineer, NAND Advanced Thin Films Process Development

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5-10 yearsEducation: phdSkills: ["Mentorship","Cross-functional collaboration","Technical leadership","Problem-solving","Innovation"]

Lead the strategic advancement and integration of structural and electrical thin-film processes for advanced NAND memory technology. Define technical direction, drive multi-functional development and scaling of process modules, and resolve complex failures through root-cause analysis. Mentor senior engineers, represent the function in technical forums, benchmark against industry standards, and manage technology transfer from R&D to high-volume manufacturing while improving cost, yield, and reliability.

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Micron Technology
Micron Technology
4 months ago

Principal Engineer, NAND Advanced Thin Films Process Development

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Job Summary

Lead the strategic advancement and integration of structural and electrical thin-film processes for advanced NAND memory technology. Define technical direction, drive multi-functional development and scaling of process modules, and resolve complex failures through root-cause analysis. Mentor senior engineers, represent the function in technical forums, benchmark against industry standards, and manage technology transfer from R&D to high-volume manufacturing while improving cost, yield, and reliability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Define and implement technical strategy for structural and electrical thin-film process development aligned to business and technology objectives.
  • •Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures and devices.
  • •Oversee end-to-end development of process modules to ensure manufacturability, scalability, and readiness for integration.
  • •Resolve complex technical challenges through root cause analysis and mitigation of process/device failures.
  • •Drive technology transfer and ramp-up from R&D to high-volume manufacturing, including benchmarking and cost, yield, and reliability improvement programs.

Key Requirements

  • •PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
  • •5-10 years of experience in Thin Film R&D for NAND processes, including CVD and Diffusion Thin Films.
  • •Demonstrated mastery of thin film deposition processes (including Atomic Layer Deposition and Chemical Vapor Deposition) for high-density NAND.
  • •Expertise in thin film characterization and electrical evaluation methods (e.g., XRR, ellipsometry, SEM/TEM, SIMS, XPS; leakage, impedance, capacitance, breakdown).
  • •Experience using statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and failure analysis.
Experience:5-10 yearsSemiconductor manufacturingNANDThin filmsR&D
Education:PhD / Doctorate in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field
Skills:MentorshipCross-functional collaborationTechnical leadershipProblem-solvingInnovation
Tech Stack:Atomic Layer DepositionChemical Vapor DepositionPlasmaThermal methodsLowKHighKX-ray Reflectivity (XRR)EllipsometryScanning Electron Microscopy (SEM)Transmission Electron Microscopy (TEM)Secondary Ion Mass Spectrometry (SIMS)X-ray Photoelectron Spectroscopy (XPS)Leakage analysisImpedanceCapacitanceBreakdown analysisChamber designPlasma source optimizationGas delivery systemsStatistical process control (SPC)

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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