ASIC Package SI/PI Engineer

OpenAI
San Francisco, California
Workplace: HybridFull timeUSD 266,000 - 445,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 5+ yearsSkills: ["Communication","Cross-functional collaboration"]

Drive signal integrity and power integrity for advanced AI/HPC ASIC packages, from early feasibility through production bring-up. Own electrical architecture, model and optimize high-speed channels (200G/400G SerDes, PCIe, HBM, DDR), and perform 2D/3D electromagnetic modeling. Translate SI/PI simulations into actionable stack-up, routing, and power-delivery requirements, collaborating across ASIC, package, system, mechanical, thermal, and validation teams.

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FursaFursa
OpenAI
OpenAI
2 days ago

ASIC Package SI/PI Engineer

āœ“ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Drive signal integrity and power integrity for advanced AI/HPC ASIC packages, from early feasibility through production bring-up. Own electrical architecture, model and optimize high-speed channels (200G/400G SerDes, PCIe, HBM, DDR), and perform 2D/3D electromagnetic modeling. Translate SI/PI simulations into actionable stack-up, routing, and power-delivery requirements, collaborating across ASIC, package, system, mechanical, thermal, and validation teams.
Location: San Francisco, California
Workplace: Hybrid
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • ā€¢Own SI/PI architecture and analysis for advanced AI ASIC packages from feasibility through production.
  • ā€¢Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces.
  • ā€¢Perform package, interposer, and substrate modeling using 2D/3D electromagnetic solvers.
  • ā€¢Define and optimize package stack-ups and transmission-line structures (via transitions, breakout/return paths, shielding, bump/ball maps) based on SI/PI requirements.
  • ā€¢Drive package-level PDN analysis and die/package co-design, including power/ground allocation, high-speed I/O placement, and simulation methodology/automation flows for SI/PI sign-off.

Pay and Benefits

Salary: USD 266,000 - 445,000 annually

Key Requirements

  • ā€¢5+ years of experience in signal integrity, power integrity, high-speed interconnect design, PDN design, and package electrical design.
  • ā€¢Strong understanding of SI/PI fundamentals including transmission-line behavior, impedance, loss, crosstalk, return paths, power-delivery networks, inductance, decoupling, voltage droop, and current distribution.
  • ā€¢Hands-on electromagnetic and SI/PI simulation experience using tools such as Synopsys HSPICE, Ansys EDT, HFSS-PI, SIwave, Cadence Clarity, and Sigrity PowerSI/PowerDC.
  • ā€¢Experience with package layout environments such as Cadence APD/SIP, including reviewing/modifying package structures for SI/PI optimization.
  • ā€¢Develop automated design optimization flows for model extraction, simulation setup, post-processing, and design-space exploration or layout optimization.
Experience:5+ years
Skills:CommunicationCross-functional collaboration
Tech Stack:Synopsys HSPICEAnsys EDTHFSS-PISIwaveCadence ClaritySigrity PowerSIPowerDCCadence APDSIPVNASpectrum analyzersTDRTDTHigh-bandwidth oscilloscopes

Company Brief

OpenAI
Develops and deploys advanced generative AI models (including ChatGPT and DALLĀ·E) and AI infrastructure, providing APIs and consumer products to accelerate safe AGI for broad benefit.
Industry: AI & Machine Learning
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Scaleup
Valuation: Hectocorn (USD 100B+)
Funding: Series E+
Headquarters: San Francisco, United States
Founded: 2015
Glassdoor
Glassdoor: 4.4
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