Director of Technology - Wafer Cleaning

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 189,000 - 260,000 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsSkills: ["Leadership","Advanced analytical judgment","Stakeholder negotiation","Strategic planning","Cross-functional influence"]

Lead post-chemical mechanical planarization (post-CMP) cleaning technology within the CMP Product Business Group. Direct complex development and technical management of post-CMP cleaning products, benchmark performance versus competitors, and define defectivity/yield-focused roadmaps. Set goals and metrics, report progress, and guide leadership in post-CMP cleaning process development while addressing customers’ high-value problems across wafer-cleaning process challenges.

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FursaFursa
Applied Materials
Applied Materials
3 months ago

Director of Technology - Wafer Cleaning

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Job Summary

Lead post-chemical mechanical planarization (post-CMP) cleaning technology within the CMP Product Business Group. Direct complex development and technical management of post-CMP cleaning products, benchmark performance versus competitors, and define defectivity/yield-focused roadmaps. Set goals and metrics, report progress, and guide leadership in post-CMP cleaning process development while addressing customers’ high-value problems across wafer-cleaning process challenges.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Director level

Key Responsibilities

  • •Direct the development and ongoing technical management of post-CMP cleaning products for the CMP Product Business Group.
  • •Develop differentiated solutions to address customers’ unusually complex process issues tied to high-value problems (HVP).
  • •Benchmark post-CMP cleaning products against competitors and all semiconductor wafers cleaning products.
  • •Develop long-term technology strategy and maintain product roadmaps focused on defectivity and yield.
  • •Define performance metrics, report progress against goals, and lead post-CMP cleaning process development.
Travel: Low travel

Pay and Benefits

Salary: USD 189,000 - 260,000 annually
Equity and Bonus:Equity

Key Requirements

  • •More than 10 years’ experience developing state-of-the-art wafer cleaning processes in a top-tier semiconductor equipment manufacturer or leading-edge semiconductor fabrication company.
  • •Broad, comprehensive understanding of state-of-the-art semiconductor wafer clean industry product offerings.
  • •Expertise in semiconductor wet cleaning technology, including particle adhesion/removal and corrosion of advanced metals.
  • •Ability to apply advanced analytical judgment to direct resolution of highly complex or unusual business problems.
  • •Demonstrated leadership through direct management of subordinates and influence of collaborators.
Experience:10+ yearsSemiconductorsSemiconductor manufacturing
Skills:LeadershipAdvanced analytical judgmentStakeholder negotiationStrategic planningCross-functional influence

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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