Director of Technology - Wafer Cleaning

Lead post-chemical mechanical planarization (post-CMP) cleaning technology within the CMP Product Business Group. Direct complex development and technical management of post-CMP cleaning products, benchmark performance versus competitors, and define defectivity/yield-focused roadmaps. Set goals and metrics, report progress, and guide leadership in post-CMP cleaning process development while addressing customers’ high-value problems across wafer-cleaning process challenges.