Advance Packaging Process Development Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Analytical skills","Problem-solving","Communication","Adaptability","Teamwork"]

Develop and optimize package assembly processes for Micron memory product ramp-ups, including frontend, bonding, and backend steps. Partner with Manufacturing teams for side-by-side certification, measure and interpret process data, and create assembly process guideline rules with global Design teams. Run, test, and upgrade systems and processes, approve material/process/equipment changes via the CCB (change control board), and improve process capability for advanced packaging technologies.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Advance Packaging Process Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Develop and optimize package assembly processes for Micron memory product ramp-ups, including frontend, bonding, and backend steps. Partner with Manufacturing teams for side-by-side certification, measure and interpret process data, and create assembly process guideline rules with global Design teams. Run, test, and upgrade systems and processes, approve material/process/equipment changes via the CCB (change control board), and improve process capability for advanced packaging technologies.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Develop, configure, and optimize package assembly processes (frontend, bonding, and backend) for memory product ramp-ups.
  • •Coordinate side-by-side certification with Manufacturing teams to assess and validate assembly processes.
  • •Assess processes using measurements and data interpretation to drive improvements.
  • •Create assembly process guideline rules and collaborate with Design teams globally.
  • •Participate in running, testing, and upgrading systems and processes, including approving changes in the CCB (change control board).

Key Requirements

  • •0–2 years of experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or frontend processes.
  • •Strong analytical and problem-solving skills to troubleshoot issues and optimize process parameters.
  • •Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
  • •Experience with high bandwidth memory (HBM) integration is a plus.
  • •Effective verbal and written communication skills to work with teams and stakeholders.
Experience:0Semiconductor manufacturingSemiconductor packagingHigh bandwidth memory (HBM)Advanced packaging
Education:Bachelor's in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field
Skills:Analytical skillsProblem-solvingCommunicationAdaptabilityTeamwork
Tech Stack:PhotoPhoto processesPhysical Vapor Deposition (PVD)Chemical Vapor Deposition (CVD)Chemical Mechanical Planarization (CMP)Wafer level moldingWafer level ball mountThermo-Compression Bonding (TCB)Flip Chip (FC)Underfill (UF)Hybrid bondGlass carrier bond/ de-bondBall MountTCBHBM integration

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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