PCB Fabrication Process Engineer

AMD
California
Workplace: OnsiteFull timeUSD 142,800 - 244,800 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Collaboration","Detail-orientation","Critical problem solving","Troubleshooting","Data collection"]

Lead PCB fabrication process engineering to drive performance, quality, and reliability for AMD datacenter GPU platform PCBs. Own process qualification and adoption of fabrication technologies to meet evolving SI/PI, power delivery, and thermal-mechanical requirements. Partner across silicon/package, board layout, validation, failure analysis, and supply chain to define technology roadmaps, address DFM yield issues, and improve processes from NPI through mass production ramp.

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FursaFursa
AMD
AMD
2 days ago

PCB Fabrication Process Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Lead PCB fabrication process engineering to drive performance, quality, and reliability for AMD datacenter GPU platform PCBs. Own process qualification and adoption of fabrication technologies to meet evolving SI/PI, power delivery, and thermal-mechanical requirements. Partner across silicon/package, board layout, validation, failure analysis, and supply chain to define technology roadmaps, address DFM yield issues, and improve processes from NPI through mass production ramp.
Location: California
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Design high performance material stacks and complex via-structure interconnects for datacenter GPU platform PCBs.
  • •Address Design for Manufacturing (DFM) queries to mitigate fabrication yield issues and derisk delivery of critical builds.
  • •Own process qualification and adoption of PCB fabrication technologies to meet rapidly evolving SI/PI, power delivery, and thermal-mechanical specifications.
  • •Define technology roadmaps, vendor engagements, and architecture design practices balancing performance, cost, and manufacturability.
  • •Drive process improvements and collaborate cross-functionally to enable PCB solutions from package to system level through NPI and mass volume ramp.

Pay and Benefits

Salary: USD 142,800 - 244,800 annually

Key Requirements

  • •Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical, etc.).
  • •Strong background in complex PCB fabrication processes and high performance electronics hardware.
  • •Expertise in PCB failure/root cause analysis using destructive and non-destructive methods.
  • •Sound knowledge of PCB manufacturing/design & fabrication guidelines and common PCBA failure mechanisms.
  • •Ability to write scripts in programming languages (e.g., Python, C/C++, MATLAB) for statistical data analysis and tool development.
Education:Bachelor's in Engineering (Electrical/Computer/Mechanical/Chemical, etc.)
Skills:CollaborationDetail-orientationCritical problem solvingTroubleshootingData collection
Languages:En-us
Tech Stack:PythonC/C++MATLABAllegro3DXRMSEMDSCDMAFTIR SpectroscopyPCIeSignal IntegrityPower DeliveryThermal-Mechanical

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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