AMD

6 days ago

Thermal Design & Validation Engineer

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Source: Company careers pageValidated by: Fursa AI

Last checked: 4 hours agoStatus: Live

Job Summary

Design, simulate, validate, and qualify liquid cooling solutions for AMD’s next-generation AI and Data Center GPU products. In the Data Center Platform Engineering Thermal Mechanical Engineering team, you will develop cold plates and liquid cooling components, run CFD and 1D flow network models, perform thermal-mechanical analysis, and execute lab validations (including leak and reliability testing). Partner cross-functionally to deliver high-performance, reliable, and manufacturable cooling systems from concept through production release.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

•Design and develop cold plates and liquid cooling components for Data Center GPU platforms from concept through validation and production release.
•Run CFD simulations (Icepak or equivalent) and 1D flow network models to optimize thermal performance, coolant distribution, pressure drop, and flow balance.
•Perform thermal-mechanical analysis of cold plate assemblies, including mounting load, tolerance stack-up, flatness, warpage, and interface contact.
•Plan and execute validation for cold plates, manifolds, tubing assemblies, and full liquid cooling systems, including flow, pressure drop, thermal resistance, leak, and reliability testing.
•Correlate test data with simulation and drive root-cause analysis and corrective actions; communicate results through technical reports and design reviews.

Key Requirements

•BS, MS, or PhD in Mechanical Engineering or a related discipline.
•Expertise in liquid cooling systems and electronics thermal management, with strong analytical, troubleshooting, and root-cause skills.
•Experience validating liquid cooling for high-power electronics, ideally AI, HPC, or Data Center server platforms.
•Cold plate design and thermal interface management, including manufacturing processes such as machining, brazing, skiving, friction stir welding, and additive manufacturing.
•Proficiency with CAD software (Creo and/or SolidWorks) and simulation tools such as Icepak, FloTHERM, and/or Ansys Fluent.

Experience:AIHPCData Center

Education:Bachelor's in Mechanical Engineering

Skills:Problem-solvingTroubleshootingRoot-cause analysisAnalytical skillsCommunication

Languages:En-us

Tech Stack:Liquid coolingCold platesCFDIcepakFloTHERMAnsys Fluent1D flow network modelingFEAGD&TCreoSolidWorksPythonMATLABLabVIEWMachiningBrazingSkivingFriction stir weldingAdditive manufacturingOCP

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD