SMTS Process Engineer RDA /Metrology

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 13+ yearsEducation: mastersSkills: ["Technical leadership","Problem solving","Cross-functional collaboration","Mentorship","Methodology development"]

Lead the development and scale-up of chip-to-wafer and hybrid bonding processes that enable high-performance 3D memory products such as HBM and 3DS DRAM. Set technical direction across development programs, mature process flows and materials, and drive problem-solving from wafer fab through bonding, thinning, and downstream packaging. Partner with integration, equipment, product, manufacturing, and quality teams, and execute technology transfer focused on repeatability and high-volume readiness.

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Micron Technology
Micron Technology
3 months ago

SMTS Process Engineer RDA /Metrology

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Job Summary

Lead the development and scale-up of chip-to-wafer and hybrid bonding processes that enable high-performance 3D memory products such as HBM and 3DS DRAM. Set technical direction across development programs, mature process flows and materials, and drive problem-solving from wafer fab through bonding, thinning, and downstream packaging. Partner with integration, equipment, product, manufacturing, and quality teams, and execute technology transfer focused on repeatability and high-volume readiness.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Set technical direction for chip-to-wafer and hybrid bonding processes across development programs.
  • •Develop and mature process flows, materials, and integrations to meet performance, reliability, and cost needs.
  • •Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions.
  • •Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs.
  • •Drive technology transfer into manufacturing with a focus on repeatability and high-volume readiness.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysPaid Leave

Key Requirements

  • •Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or related field.
  • •13+ years of semiconductor R&D experience, including 10+ years in advanced packaging.
  • •Lead multi-team technical efforts and drive decisions without formal authority.
  • •Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding.
  • •Strong understanding of process and package integration and cross-module interactions.
Experience:13+ yearsSemiconductor R&DAdvanced packaging3D memoryHBMDRAM
Education:Master's
Skills:Technical leadershipProblem solvingCross-functional collaborationMentorshipMethodology development
Tech Stack:Chip-to-waferHybrid bondingHBM3DS DRAMWafer fabDie processingBondingThinningDownstream packagingProcess flowsMaterials integrationSolder reflowTCBMetrologyFOAKEquipment developmentTechnology transferHigh-volume readiness

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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