Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Manufacturing & Production OperationsExperience: 8+ yearsEducation: mastersSkills: ["Leadership","Problem-solving","Root cause analysis","Data analysis","Communication","Mentorship","Accountability","Collaboration","Presentation"]

Lead Media Health Manufacturing for Micron’s next-generation HBM products, driving best-in-class performance against Quality, Cost, Cycle Time, and Scale. Own manufacturing test flow development, validation, and optimized test coverage across HIG HBM architectures and nodes. Improve yields through circuit debug, reliability analysis, test coverage optimization, and DFT strategy to reduce cost and test time. Partner cross-functionally (Fab, design, technology development, test solution, and quality) and mentor others.

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Micron Technology
Micron Technology
6 months ago

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)

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Job Summary

Lead Media Health Manufacturing for Micron’s next-generation HBM products, driving best-in-class performance against Quality, Cost, Cycle Time, and Scale. Own manufacturing test flow development, validation, and optimized test coverage across HIG HBM architectures and nodes. Improve yields through circuit debug, reliability analysis, test coverage optimization, and DFT strategy to reduce cost and test time. Partner cross-functionally (Fab, design, technology development, test solution, and quality) and mentor others.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations
Seniority: Mid level

Key Responsibilities

  • •Develop, validate, characterize, and qualify Micron’s next-generation HBM products and support manufacturing/test needs for new product designs.
  • •Ensure optimized test coverage on current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
  • •Improve device/stacked die yield through intrinsic/extrinsic reliability debugging, test coverage optimization, and reliability-focused strategy innovation.
  • •Reduce test time and resolve manufacturing test flow issues and yield-related device issues (DRAM, interface, stacked die).
  • •Collaborate cross-functionally with Fab, product leads, design, technology development, and quality/reliability teams; mentor and develop others while making risk and prioritization decisions.
Travel: Medium travel

Key Requirements

  • •Bachelors/Masters in Electrical and Electronics Engineering with 8+ years of experience in the semiconductor industry.
  • •Product engineering experience is preferred.
  • •Demonstrated leadership and strong technical/problem-solving skills, including root-cause understanding via in-depth circuit analysis.
  • •Good knowledge of statistics and data analysis tools and scripting.
  • •Proven record collaborating across teams to solve sophisticated business and engineering problems.
Experience:8+ yearsSemiconductor industryProduct engineeringHigh bandwidth memory (HBM)ManufacturingTest engineeringDFT
Education:Master's in Electrical and Electronics Engineering
Skills:LeadershipProblem-solvingRoot cause analysisData analysisCommunicationMentorshipAccountabilityCollaborationPresentation
Tech Stack:VerilogCADC++DFTStatisticsData analysisScripting

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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