Memory Architect

HP
Texas, Taipei
Workplace: OnsiteFull timeUSD 147,050 - 230,850 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 10+ yearsEducation: bachelorsSkills: ["Effective communication","Results orientation","Learning agility","Digital fluency","Customer centricity"]

Apply expertise in memory architectures to propose and evaluate new concepts for AI PC designs, including placements and workload optimization. Provide tradeoff guidance to reduce memory requirements and dependencies across varying configurations and workload mixes. Partner with silicon, firmware, and OS teams, influence JEDEC and vendor roadmaps, and lead qualification and integration efforts while tracking performance metrics to improve product quality.

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FursaFursa
HP
HP
3 months ago

Memory Architect

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Apply expertise in memory architectures to propose and evaluate new concepts for AI PC designs, including placements and workload optimization. Provide tradeoff guidance to reduce memory requirements and dependencies across varying configurations and workload mixes. Partner with silicon, firmware, and OS teams, influence JEDEC and vendor roadmaps, and lead qualification and integration efforts while tracking performance metrics to improve product quality.
Location: Texas, Taipei
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive footprint optimization through bandwidth/latency tradeoff analysis.
  • •Model and analyze workload sensitivity across latency, bandwidth, and cache efficiency.
  • •Partner with silicon, firmware, and OS teams on memory architectures, placements, and design.
  • •Influence supplier/IHV roadmaps (JEDEC and memory vendors) and align with technology roadmaps.
  • •Lead qualification and integration of new memory technologies, including tracking and reporting performance metrics.

Pay and Benefits

Salary: USD 147,050 - 230,850 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVisionDisability InsuranceEmployee AssistanceFlexible SpendingLife InsurancePaid HolidaysParental Leave

Key Requirements

  • •Four-year or graduate degree in Electrical Engineering or a related discipline, or equivalent work experience.
  • •Typically 10+ years of experience in electrical design, architecture of electronic hardware, or related fields.
  • •Experience with memory design and hardware architecture concepts for product development.
  • •Ability to debug and analyze systems and simulations to assess latency, bandwidth, and cache efficiency tradeoffs.
  • •Strong cross-org skills, including effective communication and learning agility.
Experience:10+ yearsHardwareElectrical engineeringAI PC
Education:Bachelor's in Electrical Engineering
Skills:Effective communicationResults orientationLearning agilityDigital fluencyCustomer centricity
Tech Stack:FPGAMATLABOscilloscopeSimulationsPrinted Circuit BoardSchematic CaptureSystems DesignJEDEC

Company Brief

HP
Designs and manufactures personal computers, printers, and related supplies, as well as provides software, services, and solutions for consumers and enterprises worldwide.
Industry: Hardware Devices
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Palo Alto, United States
Founded: 1939
Glassdoor
Glassdoor: 3.8
WebsiteLinkedIn