R&D Engineer

Broadcom
San Jose
Workplace: OnsiteFull timeUSD 167,500 - 268,000 annuallyFunction: Research & Scientific (R&D)Experience: 15+ yearsEducation: mastersSkills: ["Data analysis","Problem solving","Interpersonal skills","Risk assessment","Independent project management"]

Lead advanced packaging and multi-chip assembly R&D for leading-edge AI and high-performance computing modules. Own key technology roadmap areas and drive development from early process R&D through product introduction and high-volume manufacturing transfer. Define qualification/evaluation plans, perform yield and reliability problem solving (EFA/PFA), coordinate cross-functional and external foundry/OSAT collaboration, and support hands-on technology enablement.

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FursaFursa
Broadcom
Broadcom
2 months ago

R&D Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 days agoStatus: Live
Reposted: similar role first listed 3 months ago

Job Summary

Lead advanced packaging and multi-chip assembly R&D for leading-edge AI and high-performance computing modules. Own key technology roadmap areas and drive development from early process R&D through product introduction and high-volume manufacturing transfer. Define qualification/evaluation plans, perform yield and reliability problem solving (EFA/PFA), coordinate cross-functional and external foundry/OSAT collaboration, and support hands-on technology enablement.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Serve as technical lead for multi-chip semiconductor assembly and system pathfinding for leading-edge AI and high-performance computing modules.
  • •Own portions of the advanced packaging and assembly/system technology roadmap and develop new assembly technology through R&D to product introduction.
  • •Define technology requirements and roadmaps, create evaluation and qualification plans, and provide hands-on applications support during technology transition to product development.
  • •Lead advanced packaging technology problem solving and design/product enablement.
  • •Manage projects from concept through transfer to high-volume manufacturing, coordinating risk mitigation and communication with external foundry/assembly collaborators and internal teams.

Pay and Benefits

Salary: USD 167,500 - 268,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEsppEmployee AssistancePaid HolidaysPaid Leave

Key Requirements

  • •MSEE in Electrical Engineering (or related) with 15+ years in semiconductor process technology, advanced packaging and manufacturing R&D/integration, or PhD with 12+ years.
  • •Broad knowledge of advanced packaging, assembly, and silicon process technologies including thermal solutions, power delivery, and electrical/optical communication.
  • •Experience designing serial and parallel interfaces for chip-to-chip and external module communication.
  • •Proficiency in parametric and yield data analysis using statistical tools, including yield failure mechanisms and root-cause finding (EFA, PFA).
  • •Experience with thermal and stress simulation tools.
Experience:15+ yearsSemiconductor process technologyAdvanced packagingSilicon processSemiconductor manufacturingAIHigh-performance computing
Education:Master's in Electrical Engineering
Skills:Data analysisProblem solvingInterpersonal skillsRisk assessmentIndependent project management
Tech Stack:EFAPFAThermal and stress simulation tools

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn