Packaging Equipment Development Group Lead

Intel
Phoenix
Workplace: OnsiteFull timeUSD 180,770 - 255,200 annuallyFunction: Administration & Executive AssistanceEducation: bachelorsSkills: ["Problem-solving","Mentorship","Leadership","Strategic decision-making"]

Lead equipment development efforts for semiconductor packaging within Intel’s Assembly Technology Development organization. You’ll manage new equipment introductions, ensure smooth transitions from development to high-volume manufacturing, and drive technical decisions for module engineering activities. Partner with internal and external stakeholders to solve complex process integration challenges, build long-term equipment capability strategies, and mentor engineers to deliver world-class manufacturing solutions.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
1 day ago

Packaging Equipment Development Group Lead

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Lead equipment development efforts for semiconductor packaging within Intel’s Assembly Technology Development organization. You’ll manage new equipment introductions, ensure smooth transitions from development to high-volume manufacturing, and drive technical decisions for module engineering activities. Partner with internal and external stakeholders to solve complex process integration challenges, build long-term equipment capability strategies, and mentor engineers to deliver world-class manufacturing solutions.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Manager level

Key Responsibilities

  • •Lead a team responsible for equipment development for semiconductor packaging.
  • •Drive first-of-kind equipment introduction and development, and ensure smooth transitions to high-volume manufacturing.
  • •Manage strategic and tactical decision-making for module engineering activities aligned to Intel’s operational goals.
  • •Collaborate with manufacturing, automation, equipment suppliers, and process integration teams to optimize equipment and solve technical challenges.
  • •Develop long-term strategies for equipment capabilities and provide mentorship to engineers.

Pay and Benefits

Salary: USD 180,770 - 255,200 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering, or a related field with 9+ years of relevant experience.
  • •Or a Master's degree in the listed fields with 6+ years of relevant experience, or a PhD with 4+ years of relevant experience.
  • •Demonstrated experience in equipment development and process integration for semiconductor packaging.
  • •Proficiency in statistical methods, experimental design, and data analysis.
  • •Preferred: 3+ years of people management experience, mentoring and leading a team.
Experience:Semiconductor packagingSemiconductor assembly
Education:Bachelor's in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering
Skills:Problem-solvingMentorshipLeadershipStrategic decision-making

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor