HBM SIPI, Principal Engineer

Micron Technology
Texas, California
Workplace: OnsiteFull timeUSD 175,000 - 309,000 annuallyFunction: Communications, PR & CommunityExperience: 7+ yearsSkills: []

Lead signal integrity (SI) and power integrity (PI) analysis for 2.5D/3D HBM silicon interposers, driving power delivery architecture, impedance targets, and transient analysis. Perform electromagnetic extraction and modeling across PCB/package/interposer designs, define SI/PI standards and sign-off criteria, and provide technical direction in ambiguous design environments. Partner across the HBM roadmap to influence system-level decisions from concept to sign-off.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
3 months ago

HBM SIPI, Principal Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Lead signal integrity (SI) and power integrity (PI) analysis for 2.5D/3D HBM silicon interposers, driving power delivery architecture, impedance targets, and transient analysis. Perform electromagnetic extraction and modeling across PCB/package/interposer designs, define SI/PI standards and sign-off criteria, and provide technical direction in ambiguous design environments. Partner across the HBM roadmap to influence system-level decisions from concept to sign-off.
Location: Texas, California
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
  • •Define and drive power delivery architecture, impedance targets, and transient analysis.
  • •Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
  • •Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
  • •Provide clear technical direction in ambiguous or incomplete design environments.

Pay and Benefits

Salary: USD 175,000 - 309,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid Time-offPaid Holidays

Key Requirements

  • •7+ years of experience in signal integrity and power integrity modeling and analysis.
  • •Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design.
  • •Hands-on experience with SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight.
  • •10+ years of experience in SI and PDN modeling and analysis (preferred).
  • •Experience with 2.5D/3D advanced packaging technologies such as interposer-based designs (preferred).
Experience:7+ years
Tech Stack:ANSYSSynopsysCadenceKeysightTCLPythonElectromagnetic extractionTransmission line theoryImpedance targetsTransient analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn